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BQ25898YFFT

Texas Instruments

BQ25898YFFT by Texas Instruments

BQ25898YFFT by Texas Instruments is a Power Management IC with 42 terminals in a rectangular package. It operates b/w -40 to 125°C, supporting supply voltage from 3.9V to 14V. Ideal for automotive applications, it features a BUCK switcher configuration and adjustable threshold for power supply support circuits.

Median Price

$4.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,250 parts In-Stock

1+ parts

$3.297

100+ parts

$2.889

1k+ parts

$1.632

10k+ parts

-

21,250

$3.297

$2.889

$1.632

-

DigiKey

USA . 490 parts In-Stock

1+ parts

$4.530

100+ parts

$2.870

1k+ parts

$2.597

10k+ parts

$2.495

490

$4.530

$2.870

$2.597

$2.495

Mouser Electronics

USA . 159 parts In-Stock

1+ parts

$4.530

100+ parts

$2.870

1k+ parts

$2.490

10k+ parts

$2.430

159

$4.530

$2.870

$2.490

$2.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,955 parts In-Stock

1+ parts

$3.132

100+ parts

-

1k+ parts

-

10k+ parts

-

1,955

$3.132

-

-

-

Vyrian

USA . 1,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,911

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,206 parts In-Stock

1+ parts

$2.800

100+ parts

$2.730

1k+ parts

$2.716

10k+ parts

-

7,206

$2.800

$2.730

$2.716

-

Ampacity Inc.

Singapore . 7,042 parts In-Stock

1+ parts

$2.800

100+ parts

-

1k+ parts

-

10k+ parts

-

7,042

$2.800

-

-

-

Corphita

USA . 348 parts In-Stock

1+ parts

$2.967

100+ parts

-

1k+ parts

-

10k+ parts

-

348

$2.967

-

-

-

Corohmni

South Africa . 368 parts In-Stock

1+ parts

$3.297

100+ parts

-

1k+ parts

-

10k+ parts

-

368

$3.297

-

-

-

Parana Technologies

USA . 2,257 parts In-Stock

1+ parts

$3.867

100+ parts

-

1k+ parts

$4.351

10k+ parts

-

2,257

$3.867

-

$4.351

-

DigiPath Technology Company

USA . 1,330 parts In-Stock

1+ parts

$4.258

100+ parts

$3.917

1k+ parts

-

10k+ parts

-

1,330

$4.258

$3.917

-

-

ChromeModa Solutions

Germany . 4,935 parts In-Stock

1+ parts

$4.345

100+ parts

$3.563

1k+ parts

-

10k+ parts

-

4,935

$4.345

$3.563

-

-

IDEA Electronic Components Group

UK . 994 parts In-Stock

1+ parts

$4.345

100+ parts

-

1k+ parts

$3.910

10k+ parts

-

994

$4.345

-

$3.910

-

Microchip USA

USA . 2,785 parts In-Stock

1+ parts

$19.820

100+ parts

$19.700

1k+ parts

$19.640

10k+ parts

$19.580

2,785

$19.820

$19.700

$19.640

$19.580

Native Components

USA . 444 parts In-Stock

1+ parts

$22.420

100+ parts

-

1k+ parts

-

10k+ parts

-

444

$22.420

-

-

-

Northwest PG Solutions

USA . 577 parts In-Stock

1+ parts

$24.662

100+ parts

$22.196

1k+ parts

-

10k+ parts

-

577

$24.662

$22.196

-

-

Lixinc

USA . 11,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,644

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

SIE Connect GmbH (Excess)

Germany . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

560

-

-

-

-

A-Z Elektronik GmbH

Germany . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Overview

Experience the next level of power management with the BQ25898YFFT by Texas Instruments. This innovative Power Management IC offers top-tier quality and reliability, backed by the reputable manufacturer's years of expertise in the field. Ideal for a wide range of applications, this product provides exceptional value and benefits to customers looking for efficient and effective power supply support circuits. Upgrade your systems with the BQ25898YFFT and enjoy the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape is compatible with standard PCB layouts, making integration into existing designs seamless.

No. of Terminals: 42

Having 42 terminals provides ample connectivity options, allowing for versatile usage in various circuit configurations.

Package Style (Meter): GRID ARRAY

Grid array packaging offers high terminal density, enabling a compact design without compromising on functionality.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in demanding industrial or automotive environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environmental conditions, enhancing the versatility of the IC.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance for long-term performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process.

Maximum Seated Height: 0.415 mm

Low seated height contributes to the overall compactness of the IC, ideal for space-constrained applications.

Width (mm): 2.4 mm

Narrow width makes the IC suitable for applications where board space is limited, offering design flexibility.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Power supply support circuit design ensures stable and efficient power delivery to connected devices, enhancing system performance.

Minimum Supply Voltage (Vsup): 3.9 V

Low minimum supply voltage requirement allows for operation in low-power scenarios, extending the range of compatible applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables robust solder joints and ensures long-term durability of the IC.

Length: 2.8 mm

Compact length contributes to the overall small footprint of the IC, making it suitable for space-constrained designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive environments with varying temperature conditions.

Maximum Supply Current (Isup): 3 mA

Low maximum supply current requirement helps in reducing power consumption and heat dissipation, improving overall efficiency.

Terminal Form: BALL

Ball terminal form offers reliable electrical connections and enables high-density packaging, suitable for advanced electronic applications.

Switcher Config: BUCK

BUCK switcher configuration is known for its efficiency in converting and regulating power, making the IC an energy-efficient choice.

Terminal Pitch: 0.4 mm

Narrow terminal pitch enables high-density mounting on PCBs, reducing the overall size of the circuit layout.

Maximum Supply Voltage (Vsup): 14 V

High maximum supply voltage rating makes the IC suitable for a wide range of applications with varying voltage requirements.

Adjustable Threshold: YES

Adjustable threshold feature allows for customization and optimization of the IC according to specific system requirements, enhancing flexibility.

Technical Specifications

Power Management ICs BQ25898YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B42

JESD-609 Code:

e1

Length:

2.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.415 mm

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

3.9 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.4 mm

Trade Compliance

BQ25898YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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