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BQ25898CYFFT

Texas Instruments

BQ25898CYFFT by Texas Instruments

BQ25898CYFFT by Texas Instruments is a Power Management IC with 42 terminals in a rectangular package. It operates b/w -40 to 125°C, supporting supply voltage from 3.9V to 14V. Ideal for automotive applications, it features a very thin profile and fine pitch grid array package style.

Median Price

$4.126

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 250 parts In-Stock

1+ parts

$1.740

100+ parts

$1.710

1k+ parts

$1.670

10k+ parts

-

250

$1.740

$1.710

$1.670

-

Texas Instruments

USA . 3,500 parts In-Stock

1+ parts

$3.442

100+ parts

$3.016

1k+ parts

$1.704

10k+ parts

-

3,500

$3.442

$3.016

$1.704

-

DigiKey

USA . 559 parts In-Stock

1+ parts

$4.810

100+ parts

$3.055

1k+ parts

$2.768

10k+ parts

$2.660

559

$4.810

$3.055

$2.768

$2.660

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$4.810

100+ parts

$3.060

1k+ parts

$2.680

10k+ parts

$2.650

3

$4.810

$3.060

$2.680

$2.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,482 parts In-Stock

1+ parts

$3.270

100+ parts

-

1k+ parts

-

10k+ parts

-

1,482

$3.270

-

-

-

Vyrian

USA . 7,301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,301

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 986 parts In-Stock

1+ parts

$2.930

100+ parts

-

1k+ parts

-

10k+ parts

-

986

$2.930

-

-

-

Semicontronic

India . 971 parts In-Stock

1+ parts

$2.930

100+ parts

$2.857

1k+ parts

$2.842

10k+ parts

-

971

$2.930

$2.857

$2.842

-

Corphita

USA . 573 parts In-Stock

1+ parts

$3.098

100+ parts

-

1k+ parts

-

10k+ parts

-

573

$3.098

-

-

-

Corohmni

South Africa . 485 parts In-Stock

1+ parts

$3.442

100+ parts

-

1k+ parts

-

10k+ parts

-

485

$3.442

-

-

-

Parana Technologies

USA . 1,241 parts In-Stock

1+ parts

$13.564

100+ parts

$1,259.586

1k+ parts

$12.207

10k+ parts

-

1,241

$13.564

$1,259.586

$12.207

-

DigiPath Technology Company

USA . 2,265 parts In-Stock

1+ parts

$14.935

100+ parts

$13.740

1k+ parts

-

10k+ parts

-

2,265

$14.935

$13.740

-

-

IDEA Electronic Components Group

UK . 2,185 parts In-Stock

1+ parts

$15.240

100+ parts

$14.478

1k+ parts

$13.716

10k+ parts

-

2,185

$15.240

$14.478

$13.716

-

ChromeModa Solutions

Germany . 225 parts In-Stock

1+ parts

$15.240

100+ parts

$12.497

1k+ parts

-

10k+ parts

-

225

$15.240

$12.497

-

-

Kepictronics

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,500

-

-

-

-

Assy Fe

Spain . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Northwest PG Solutions

USA . 2,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,181

-

-

-

-

Perfect Parts

USA . 1,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,120

-

-

-

-

Native Components

USA . 716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

716

-

-

-

-

Overview

Enhance your power management solutions with the BQ25898CYFFT by Texas Instruments, a top-tier manufacturer known for their quality products. This Power Management IC is designed to optimize performance and efficiency, making it ideal for a wide range of applications. With its advanced features and innovative design, this product offers customers unmatched value, benefits, and advantages. Upgrade your devices with the BQ25898CYFFT and experience the difference in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging provides durability and protection for the Power Management IC, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy and secure mounting on circuit boards, saving space and simplifying the manufacturing process.

No. of Terminals: 42

Having 42 terminals allows for more connectivity options and flexibility in designing power supply circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the IC can withstand demanding operating conditions without risk of damage or performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the IC to function effectively in cold environments without loss of performance.

Width (mm): 2.53 mm

The slim width of 2.53mm allows for efficient use of space in compact electronic devices.

Minimum Supply Voltage (Vsup): 3.9 V

The minimum supply voltage of 3.9V ensures compatibility with a wide range of power sources, making it versatile for various applications.

Maximum Supply Current (Isup): 3 mA

The low maximum supply current of 3mA helps in minimizing power consumption and heat dissipation, leading to energy efficiency.

Technical Specifications

Power Management ICs BQ25898CYFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B42

JESD-609 Code:

e1

Length:

2.82 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

3.9 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.53 mm

Trade Compliance

BQ25898CYFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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