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BQ25882YFFR

Texas Instruments

BQ25882YFFR by Texas Instruments

BQ25882YFFR by Texas Instruments is a Power Management IC with 25 terminals, operating from -40 to 85°C. It supports Boost switcher config, has adjustable threshold, and operates at 3.9-6.2V for industrial applications.

Median Price

$3.768

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,143 parts In-Stock

1+ parts

$3.768

100+ parts

$3.072

1k+ parts

$2.048

10k+ parts

-

11,143

$3.768

$3.072

$2.048

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,350 parts In-Stock

1+ parts

$3.580

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-

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1,350

$3.580

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Vyrian

USA . 6,242 parts In-Stock

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6,242

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Distributors (Availability)

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Semicontronic

India . 10,643 parts In-Stock

1+ parts

$3.200

100+ parts

$3.120

1k+ parts

$3.104

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-

10,643

$3.200

$3.120

$3.104

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Corphita

USA . 3,131 parts In-Stock

1+ parts

$3.391

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-

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3,131

$3.391

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Corohmni

South Africa . 170 parts In-Stock

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$3.768

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170

$3.768

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Ampacity Inc.

Singapore . 11,007 parts In-Stock

1+ parts

$6.970

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11,007

$6.970

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AZTECH Wire

Italy . 1,144 parts In-Stock

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$12.770

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1,144

$12.770

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Parana Technologies

USA . 1,702 parts In-Stock

1+ parts

$21.409

100+ parts

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$21.756

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1,702

$21.409

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$21.756

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DigiPath Technology Company

USA . 120 parts In-Stock

1+ parts

$23.574

100+ parts

$21.688

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120

$23.574

$21.688

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ChromeModa Solutions

Germany . 3,042 parts In-Stock

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$24.055

100+ parts

$19.725

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3,042

$24.055

$19.725

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IDEA Electronic Components Group

UK . 1,305 parts In-Stock

1+ parts

$24.055

100+ parts

$22.852

1k+ parts

$21.650

10k+ parts

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1,305

$24.055

$22.852

$21.650

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A-Z Elektronik GmbH

Germany . 11,250 parts In-Stock

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Lixinc

USA . 1,754 parts In-Stock

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Native Components

USA . 978 parts In-Stock

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978

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Northwest PG Solutions

USA . 894 parts In-Stock

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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300

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iodParts Technologies Inc.

India . 198 parts In-Stock

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198

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Kepictronics

USA . 118 parts In-Stock

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118

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Overview

Experience unmatched power management efficiency with the BQ25882YFFR by Texas Instruments. This cutting-edge Power Management IC offers exceptional quality and reliability that Texas Instruments is renowned for. Perfect for a wide range of applications, this Surface Mount package boasts a sleek SQUARE design and 25 terminals for seamless integration. With a Nominal Supply Voltage of 5 V and a Temperature Grade of INDUSTRIAL, this IC promises to deliver superior performance in any environment. Trust Texas Instruments to provide you with the best power supply support circuit on the market.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design, ideal for applications where board space is limited.

Nominal Supply Voltage (Vsup): 5 V

Stable 5V supply voltage ensures consistent power delivery, suitable for a wide range of electronic devices.

No. of Terminals: 25

Having 25 terminals allows for versatile connectivity options, enabling the IC to support multiple functions within a single package.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the IC to function effectively in extreme cold conditions, making it suitable for a variety of applications.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of the IC.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and installation onto the PCB, facilitating a streamlined assembly process.

Maximum Seated Height: 0.625 mm

Low maximum seated height contributes to a slim profile design, making it suitable for compact electronic devices where space is limited.

Width (mm): 2.105 mm

Narrow width dimension enables the IC to fit within tight spaces on the PCB, offering flexibility in board layout and design.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed as a power supply support circuit, ensuring stable and efficient power delivery to connected components, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 3.9 V

Low minimum supply voltage requirement allows for operation even with lower input voltages, increasing compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during production processes without compromising performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the IC can withstand harsh soldering processes, maintaining its integrity and functionality.

Length: 2.105 mm

Compact length dimension allows for a space-efficient design, ideal for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating indicates that the IC is capable of operating reliably in tough industrial environments, ensuring durability and performance under challenging conditions.

No. of Channels: 2

Dual-channel capability provides flexibility in power management and distribution, making it suitable for applications requiring multiple power outputs.

Terminal Form: BALL

Ball terminal form allows for reliable solder joints and secure connections, ensuring robust electrical connections for long-term performance.

Switcher Config: BOOST

Boost switcher configuration helps to efficiently increase the output voltage level, making it suitable for applications that require a higher voltage output than the input supply.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm enables high-density mounting, making it suitable for applications where space savings and miniaturization are important factors.

Maximum Supply Voltage (Vsup): 6.2 V

6.2V maximum supply voltage support allows the IC to handle higher voltage inputs, providing flexibility and compatibility with a wide range of power sources.

Adjustable Threshold: YES

Adjustable threshold feature enables customization of voltage cutoff levels, allowing for precise control and optimization of power management functions.

Technical Specifications

Power Management ICs BQ25882YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XBGA-B25

JESD-609 Code:

e1

Length:

2.105 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

6.2 V

Minimum Supply Voltage (Vsup):

3.9 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BOOST

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.105 mm

Trade Compliance

BQ25882YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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