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BQ25100AYFPR

Texas Instruments

BQ25100AYFPR by Texas Instruments

BQ25100AYFPR by Texas Instruments is a Power Management IC with a package style of GRID ARRAY, very thin profile, and fine pitch. It operates b/w -40 to 85°C and supports a min supply voltage of 4.45V. Ideal for power supply support circuits in compact electronic devices due to its small form factor and low operating temperatures.

Median Price

$1.022

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,958 parts In-Stock

1+ parts

$1.317

100+ parts

$1.088

1k+ parts

$0.588

10k+ parts

-

29,958

$1.317

$1.088

$0.588

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Verical

USA . 121 parts In-Stock

1+ parts

-

100+ parts

$0.727

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-

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121

-

$0.727

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,766 parts In-Stock

1+ parts

$1.251

100+ parts

-

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3,766

$1.251

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Chip Stock

USA . 13,682 parts In-Stock

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13,682

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Vyrian

USA . 6,351 parts In-Stock

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-

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6,351

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Cyclops Electronics Ltd

UK . 934 parts In-Stock

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934

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Distributors (Availability)

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Corphita

USA . 4,338 parts In-Stock

1+ parts

$1.185

100+ parts

-

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4,338

$1.185

-

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Parana Technologies

USA . 1,979 parts In-Stock

1+ parts

$5.578

100+ parts

-

1k+ parts

$6.366

10k+ parts

-

1,979

$5.578

-

$6.366

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DigiPath Technology Company

USA . 962 parts In-Stock

1+ parts

$6.142

100+ parts

$5.650

1k+ parts

-

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962

$6.142

$5.650

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ChromeModa Solutions

Germany . 5,054 parts In-Stock

1+ parts

$6.267

100+ parts

$5.139

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-

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5,054

$6.267

$5.139

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IDEA Electronic Components Group

UK . 1,003 parts In-Stock

1+ parts

$6.267

100+ parts

-

1k+ parts

$5.640

10k+ parts

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1,003

$6.267

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$5.640

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AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$13.860

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253

$13.860

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Lixinc

USA . 17,798 parts In-Stock

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17,798

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Kepictronics

USA . 9,217 parts In-Stock

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9,217

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A-Z Elektronik GmbH

Germany . 2,798 parts In-Stock

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2,798

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Alle Elektronik GmbH

Germany . 1,865 parts In-Stock

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1,865

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Northwest PG Solutions

USA . 1,631 parts In-Stock

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1,631

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Native Components

USA . 495 parts In-Stock

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495

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Authorized Procurement Solutions

USA . 450 parts In-Stock

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450

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Overview

Enhance the efficiency and reliability of your power management systems with the BQ25100AYFPR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and performance in their products. This Power Management IC is designed for various applications, offering customers unparalleled value and benefits. Say goodbye to power-related issues and experience seamless operations with this innovative solution. Choose Texas Instruments for optimal performance and peace of mind.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the board, maximizing component placement.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable operation even in demanding environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, providing versatility in various operating conditions.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and excellent conductivity, improving the overall performance and longevity of the product.

Width (mm): 1.4 mm

Compact width allows for space-saving on the circuit board, enabling more components to be installed in a limited area.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power management applications, ensuring efficient and reliable power supply support.

Maximum Supply Voltage (Vsup): 6.45 V

Capable of handling high supply voltages, making it suitable for a wide range of power management applications.

Technical Specifications

Power Management ICs BQ25100AYFPR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B6

JESD-609 Code:

e1

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

6.45 V

Minimum Supply Voltage (Vsup):

4.45 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.4 mm

Trade Compliance

BQ25100AYFPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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