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BQ25070DQCT

Texas Instruments

BQ25070DQCT by Texas Instruments

BQ25070DQCT by Texas Instruments is a power management IC with a nominal voltage of 4.5V and max operating temperature of 85°C. It is used as a power supply support circuit in industrial applications.

Median Price

$2.530

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 425 parts In-Stock

1+ parts

$2.530

100+ parts

$1.540

1k+ parts

$1.379

10k+ parts

$1.283

425

$2.530

$1.540

$1.379

$1.283

Mouser Electronics

USA . 263 parts In-Stock

1+ parts

$2.530

100+ parts

$1.550

1k+ parts

$1.330

10k+ parts

$1.280

263

$2.530

$1.550

$1.330

$1.280

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,147 parts In-Stock

1+ parts

-

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4,147

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Vyrian

USA . 3,271 parts In-Stock

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3,271

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VNN

France . 1,000 parts In-Stock

1+ parts

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1,000

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 62 parts In-Stock

1+ parts

$1.030

100+ parts

-

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62

$1.030

-

-

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AZTECH Wire

Italy . 716 parts In-Stock

1+ parts

$6.588

100+ parts

-

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716

$6.588

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Corohmni

South Africa . 279 parts In-Stock

1+ parts

$9.638

100+ parts

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279

$9.638

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Parana Technologies

USA . 1,585 parts In-Stock

1+ parts

$11.590

100+ parts

-

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$11.992

10k+ parts

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1,585

$11.590

-

$11.992

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DigiPath Technology Company

USA . 1,580 parts In-Stock

1+ parts

$12.763

100+ parts

$11.742

1k+ parts

-

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1,580

$12.763

$11.742

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ChromeModa Solutions

Germany . 3,138 parts In-Stock

1+ parts

$13.023

100+ parts

$10.679

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3,138

$13.023

$10.679

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IDEA Electronic Components Group

UK . 1,539 parts In-Stock

1+ parts

$13.023

100+ parts

$12.372

1k+ parts

$11.721

10k+ parts

-

1,539

$13.023

$12.372

$11.721

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Continental Prestige Electronics

USA . 5,653 parts In-Stock

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5,653

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 4,405 parts In-Stock

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4,405

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Corphita

USA . 4,238 parts In-Stock

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4,238

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the BQ25070DQCT, a high-quality Power Management IC by Texas Instruments. With its advanced technology and reliable manufacturing, this product offers numerous advantages for various applications. From power supply support circuits to industrial-grade temperature tolerance, it delivers exceptional value and benefits to customers. Experience the convenience of a small outline, heat sink profile, and surface mount capabilities. Say goodbye to traditional bulky solutions and embrace the compact and efficient design of the BQ25070DQCT.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy as the package body material provides durability and cost-effectiveness, making this product a good choice for power management applications.

Surface Mount:

YES - The surface mount capability allows for easy and efficient installation, making this product suitable for compact and space-constrained designs.

No. of Functions:

1 - With a single function, this power management IC simplifies circuit design and reduces complexity, making it a reliable and efficient choice.

Package Shape:

RECTANGULAR - The rectangular package shape offers ease of integration into a variety of systems, allowing for flexibility in design and compatibility with different layouts.

Nominal Supply Voltage (Vsup):

4.5 V - The 4.5 V nominal supply voltage ensures stable and consistent power input, making this IC ideal for applications requiring a specific voltage range.

No. of Terminals:

10 - The 10 terminals enable secure and reliable connections, ensuring efficient power management and reducing the risk of loose connections.

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - The small outline, heat sink/slug, and very thin profile package style offers excellent thermal management, promoting optimal performance and reliability even in limited space conditions.

Maximum Operating Temperature:

85 °C - With a maximum operating temperature of 85°C, this power management IC can handle high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature:

40 °C - The ability to operate in extremely low temperatures down to -40°C ensures reliable functionality in harsh environments, enhancing the versatility of this product.

Terminal Finish:

NICKEL PALLADIUM GOLD - The nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring long-term reliability and making this IC a durable choice.

Terminal Position:

DUAL - The dual terminal position provides flexibility in board layout and facilitates efficient power distribution, enabling convenient integration into various systems.

Maximum Seated Height:

0.8 mm - With a maximum seated height of only 0.8 mm, this power management IC offers a low-profile design, making it suitable for compact and space-saving applications.

Width (mm):

2 mm - The compact width of 2 mm allows for easy integration into small form factor designs, providing versatility and fit for various applications.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT - This power management IC serves as a power supply support circuit, ensuring stable and efficient power delivery, making it an excellent choice for powering electronic devices reliably and effectively.

Minimum Supply Voltage (Vsup):

3.75 V - The minimum supply voltage requirement of 3.75 V allows for flexibility in power input, making this IC compatible with a wide range of power sources.

Maximum Time at Peak Reflow Temperature (s):

30 - With a maximum time of 30 seconds at peak reflow temperature, this IC offers robust soldering reliability, ensuring proper connection and facilitating efficient manufacturing processes.

Peak Reflow Temperature °C:

260 - The peak reflow temperature of 260°C allows for secure soldering and minimizes the risk of damage during assembly processes, enhancing the overall quality and reliability of the product.

Length:

3 mm - The compact length of 3 mm enables easy integration into space-constrained designs, making this power management IC suitable for compact electronic devices.

Nominal Threshold Voltage (V):

+3.5V - The nominal threshold voltage of +3.5V ensures accurate and reliable voltage triggering, making this IC highly suitable for precise power management applications.

Temperature Grade:

INDUSTRIAL - With an industrial temperature grade, this power management IC is designed to operate reliably under demanding environmental conditions, making it suitable for industrial applications.

Maximum Supply Current (Isup):

3 mA - The maximum supply current of 3 mA ensures efficient power consumption, making this IC energy-efficient and cost-effective.

No. of Channels:

1 - With a single channel, this power management IC simplifies circuit design and provides a straightforward solution for power management in various applications.

Terminal Form:

NO LEAD - The no lead terminal form enhances soldering reliability and simplifies the assembly process, making this IC a convenient choice for manufacturing.

Terminal Pitch:

0.5 mm - With a terminal pitch of 0.5 mm, this power management IC offers compatibility with standard PCB designs, facilitating easy integration and ensuring reliable connections.

Moisture Sensitivity Level (MSL):

2 - The moisture sensitivity level 2 ensures the IC's resistance to moisture-induced damage during storage and manufacturing processes, making it reliable and suitable for diverse environments.

Maximum Supply Voltage (Vsup):

10.2 V - With a maximum supply voltage of 10.2 V, this power management IC can handle higher input voltages, providing flexibility for various power source configurations.

Adjustable Threshold:

YES - The adjustable threshold feature allows for customizable voltage triggers, offering flexibility in power management applications and making this IC versatile and adaptable.

Technical Specifications

Power Management ICs BQ25070DQCT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

3.75 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.5V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

BQ25070DQCT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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