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AFE1230E-1/1KG4

Texas Instruments

AFE1230E-1/1KG4 by Texas Instruments

AFE1230E-1/1KG4 by Texas Instruments is a digital transmission interface with 28 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This telecom IC has a nominal voltage of 3.3V and terminal pitch of 0.65mm, ideal for digital SLIC applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,575 parts In-Stock

1+ parts

-

100+ parts

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4,575

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Digiode

USA . 564 parts In-Stock

1+ parts

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564

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 326 parts In-Stock

1+ parts

$0.271

100+ parts

-

1k+ parts

-

10k+ parts

$0.260

326

$0.271

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-

$0.260

Northwest PG Solutions

USA . 1,663 parts In-Stock

1+ parts

$0.298

100+ parts

-

1k+ parts

-

10k+ parts

$0.263

1,663

$0.298

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-

$0.263

Parana Technologies

USA . 158 parts In-Stock

1+ parts

$6.747

100+ parts

-

1k+ parts

$7.419

10k+ parts

-

158

$6.747

-

$7.419

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DigiPath Technology Company

USA . 716 parts In-Stock

1+ parts

$7.429

100+ parts

$6.835

1k+ parts

-

10k+ parts

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716

$7.429

$6.835

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ChromeModa Solutions

Germany . 3,818 parts In-Stock

1+ parts

$7.581

100+ parts

$6.216

1k+ parts

-

10k+ parts

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3,818

$7.581

$6.216

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IDEA Electronic Components Group

UK . 734 parts In-Stock

1+ parts

$7.581

100+ parts

-

1k+ parts

$6.823

10k+ parts

-

734

$7.581

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$6.823

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AZTECH Wire

Italy . 850 parts In-Stock

1+ parts

$10.575

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850

$10.575

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One Stop Electronics

USA . 270 parts In-Stock

1+ parts

$907.000

100+ parts

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270

$907.000

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Corphita

USA . 4,250 parts In-Stock

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4,250

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Overview

Upgrade your digital transmission interfaces with the AFE1230E-1/1KG4 by Texas Instruments. Known for their top-quality products, this sleek and compact device offers unmatched performance in a variety of applications. Whether you're looking to enhance your telecom systems or improve data transmission, this innovative solution will streamline your operations and boost efficiency. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and drives results. Experience the difference today with the AFE1230E-1/1KG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Terminals: 28

Having 28 terminals provides flexibility in connecting other devices or components, enhancing the functionality of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is commonly used in digital circuits, making it compatible with a wide range of applications.

Technical Specifications

Digital Transmission Interfaces AFE1230E-1/1KG4 attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

AFE1230E-1/1KG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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