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ADS62C17IRGC25

Texas Instruments

ADS62C17IRGC25 by Texas Instruments

The Texas Instruments ADS62C17IRGC25 is an 11-bit ADC with 2 analog input channels, operating at a sample rate of 200 MHz. It features a max linearity error of 0.1221% and supports power supplies of 1.8V and 3.3V. Ideal for industrial applications requiring high-speed data conversion in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,532 parts In-Stock

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7,532

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Digiode

USA . 635 parts In-Stock

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635

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One Stop Electronics

USA . 412 parts In-Stock

1+ parts

$2.000

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-

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412

$2.000

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AZTECH Wire

Italy . 336 parts In-Stock

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$17.349

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336

$17.349

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Parana Technologies

USA . 1,113 parts In-Stock

1+ parts

$21.406

100+ parts

$1,987.898

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$19.266

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1,113

$21.406

$1,987.898

$19.266

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DigiPath Technology Company

USA . 932 parts In-Stock

1+ parts

$23.571

100+ parts

$21.685

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932

$23.571

$21.685

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ChromeModa Solutions

Germany . 1,330 parts In-Stock

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$24.052

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$19.723

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1,330

$24.052

$19.723

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IDEA Electronic Components Group

UK . 578 parts In-Stock

1+ parts

$24.052

100+ parts

$22.849

1k+ parts

$21.647

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578

$24.052

$22.849

$21.647

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Corphita

USA . 3,556 parts In-Stock

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Microchip USA

USA . 2,828 parts In-Stock

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2,828

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Northwest PG Solutions

USA . 1,369 parts In-Stock

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1,369

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Native Components

USA . 449 parts In-Stock

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Overview

Unlock the power of precise data conversion with the ADS62C17IRGC25 by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers unmatched quality and reliability. This versatile chip features 2 analog input channels, 11 bits resolution, and a sample rate of 200 MHz, making it ideal for industrial applications where accuracy is crucial. With a compact square package and a wide temperature range, this converter offers exceptional value and performance. Trust Texas Instruments to provide the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the converter, ensuring long-term reliability.

No. of Analog In Channels: 2

Having two analog input channels allows for more versatile input options and can accommodate a wider range of signal sources.

Surface Mount: YES

The surface mount capability makes installation easier and more compact, saving space on the PCB and simplifying the assembly process.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this converter can withstand harsh environmental conditions and maintain performance in a variety of applications.

Sample Rate: 200 MHz

The high sample rate allows for fast and accurate conversion of analog signals, making this converter suitable for high-speed data acquisition and processing.

Technical Specifications

Analog-to-Digital Converters ADS62C17IRGC25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

11

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1221 %

Sample Rate:

200 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS62C17IRGC25 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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