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ADS6443IRGCTG4

Texas Instruments

ADS6443IRGCTG4 by Texas Instruments

ADS6443IRGCTG4 by Texas Instruments is a 14-bit ADC with 4 analog input channels, operating at a sample rate of 80 MHz. It features a max linearity error of 0.0275%, suitable for industrial applications requiring precise analog-to-digital conversion. This CMOS technology chip comes in a compact square package with surface mount capability and operates within a temperature range of -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,041 parts In-Stock

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Digiode

USA . 3,049 parts In-Stock

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3,049

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VNN

France . 2,338 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Semicontronic

India . 915 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

1k+ parts

$6.790

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915

$7.000

$6.825

$6.790

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Parana Technologies

USA . 21 parts In-Stock

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$13.254

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$13.760

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AZTECH Wire

Italy . 582 parts In-Stock

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$14.541

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582

$14.541

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DigiPath Technology Company

USA . 268 parts In-Stock

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$14.594

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$13.427

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268

$14.594

$13.427

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IDEA Electronic Components Group

UK . 1,118 parts In-Stock

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$14.892

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$14.147

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$13.403

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ChromeModa Solutions

Germany . 928 parts In-Stock

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$14.892

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$12.211

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$14.892

$12.211

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Corohmni

South Africa . 838 parts In-Stock

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$15.015

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One Stop Electronics

USA . 547 parts In-Stock

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$28.000

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Ampacity Inc.

Singapore . 363 parts In-Stock

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Corphita

USA . 4,125 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 899 parts In-Stock

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Continental Prestige Electronics

USA . 593 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 218 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the ADS6443IRGCTG4 Analog-to-Digital Converter by industry leader Texas Instruments. This cutting-edge device boasts a superior design, offering customers seamless integration into a variety of applications. With 4 analog input channels and a 14-bit resolution, this converter delivers accurate results while operating under industrial-grade conditions. Transform your projects with the power of Texas Instruments technology, providing unmatched performance and value for all your analog-to-digital conversion needs.

Feature Benefit Bullets

No. of Analog In Channels: 4

Having 4 analog input channels allows for simultaneous conversion of multiple analog signals, making this ADC suitable for multi-channel applications.

No. of Bits: 14

With 14 bits resolution, this ADC can provide accurate and precise digital representation of analog signals, offering high resolution for various applications.

Sample Rate: 80 MHz

High sample rate of 80 MHz allows for fast conversion of analog signals to digital, making it suitable for applications that require quick data acquisition and processing.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with digital circuits, making this ADC efficient and reliable for various electronic systems.

Output Bit Code: BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY

Supporting multiple output bit codes gives flexibility in interfacing with different systems and processing digital output data effectively.

Technical Specifications

Analog-to-Digital Converters ADS6443IRGCTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0275 %

Sample Rate:

80 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6443IRGCTG4 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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