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ADS6124IRHBTG4

Texas Instruments

ADS6124IRHBTG4 by Texas Instruments

The Texas Instruments ADS6124IRHBTG4 is a 12-bit ADC with 105 MHz sample rate, 0.0488% linearity error, and 3.3V supply voltage. Ideal for industrial applications, it offers binary output codes in a compact chip carrier package suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,968 parts In-Stock

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4,968

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Vyrian

USA . 4,949 parts In-Stock

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4,949

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 283 parts In-Stock

1+ parts

$0.256

100+ parts

-

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$0.246

283

$0.256

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-

$0.246

Northwest PG Solutions

USA . 1,489 parts In-Stock

1+ parts

$0.281

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-

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$0.248

1,489

$0.281

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$0.248

AZTECH Wire

Italy . 698 parts In-Stock

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$5.806

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698

$5.806

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Corohmni

South Africa . 480 parts In-Stock

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$10.332

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480

$10.332

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Parana Technologies

USA . 1,497 parts In-Stock

1+ parts

$12.553

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$13.007

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1,497

$12.553

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$13.007

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DigiPath Technology Company

USA . 2,168 parts In-Stock

1+ parts

$13.823

100+ parts

$12.717

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2,168

$13.823

$12.717

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ChromeModa Solutions

Germany . 6,545 parts In-Stock

1+ parts

$14.105

100+ parts

$11.566

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6,545

$14.105

$11.566

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$14.105

100+ parts

$13.400

1k+ parts

$12.694

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1,546

$14.105

$13.400

$12.694

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One Stop Electronics

USA . 231 parts In-Stock

1+ parts

$15.000

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231

$15.000

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Lixinc

USA . 12,124 parts In-Stock

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Corphita

USA . 2,600 parts In-Stock

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2,600

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Overview

Unlock the potential of your analog-to-digital conversion projects with the ADS6124IRHBTG4 by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers top-of-the-line Analog-to-Digital Converters that are perfect for a wide range of applications. From industrial automation to consumer electronics, this innovative product offers unmatched precision and performance. Experience the value and benefits of Texas Instruments' ADS6124IRHBTG4 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the converter, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during the manufacturing process.

No. of Bits: 12

High resolution of 12 bits ensures accurate conversion of analog signals to digital data, resulting in precise and reliable performance.

Maximum Linearity Error (EL): 0.0488 %

Low linearity error indicates minimal distortion in the converted signal, maintaining signal integrity and fidelity.

Power Supplies (V): 3.3

Operates on a standard 3.3V power supply, making it compatible with a wide range of electronic systems.

Maximum Operating Temperature: 85 °C

Capable of operating in high temperature environments, ensuring stable performance even in challenging conditions.

Sample Rate: 105 MHz

High sample rate allows for rapid conversion of analog signals, enabling real-time data acquisition and processing.

Technical Specifications

Analog-to-Digital Converters ADS6124IRHBTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

105 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC32,.2SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6124IRHBTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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