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ADC3682IRSBR

Texas Instruments

ADC3682IRSBR by Texas Instruments

Texas Instruments ADC3682IRSBR is an 18-bit ADC with 2 analog in channels, operating from -40 to 105°C. It features a sample rate of 25 MHz and max analog input voltage of ±3.2V. Ideal for applications requiring high precision data conversion in compact designs.

Median Price

$83.790

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,630 parts In-Stock

1+ parts

$83.790

100+ parts

$81.270

1k+ parts

$63.000

10k+ parts

-

11,630

$83.790

$81.270

$63.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,843 parts In-Stock

1+ parts

$79.600

100+ parts

-

1k+ parts

-

10k+ parts

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3,843

$79.600

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Vyrian

USA . 5,582 parts In-Stock

1+ parts

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5,582

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 905 parts In-Stock

1+ parts

$16.240

100+ parts

-

1k+ parts

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905

$16.240

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-

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Semicontronic

India . 11,625 parts In-Stock

1+ parts

$71.220

100+ parts

$69.440

1k+ parts

$69.083

10k+ parts

-

11,625

$71.220

$69.440

$69.083

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Ampacity Inc.

Singapore . 11,247 parts In-Stock

1+ parts

$71.220

100+ parts

-

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11,247

$71.220

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Corphita

USA . 505 parts In-Stock

1+ parts

$75.411

100+ parts

-

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505

$75.411

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Corohmni

South Africa . 493 parts In-Stock

1+ parts

$83.790

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493

$83.790

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Northwest PG Solutions

USA . 1,229 parts In-Stock

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1,229

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Native Components

USA . 571 parts In-Stock

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571

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Overview

Experience superior performance with the Texas Instruments ADC3682IRSBR Analog-to-Digital Converter. Crafted with precision and expertise by a renowned manufacturer, this converter offers unmatched quality and reliability. Ideal for a wide range of applications, this product delivers exceptional value by providing accurate and efficient conversion of analog signals to digital data. Upgrade your systems with the ADC3682IRSBR and enjoy seamless operation, enhanced functionality, and optimal results. Unlock endless possibilities with this innovative solution from Texas Instruments.

Feature Benefit Bullets

No. of Analog In Channels: 2

Having 2 analog input channels allows for multiple signals to be converted simultaneously, increasing efficiency and flexibility.

No. of Bits: 18

With 18 bits, this ADC offers high resolution and accuracy in converting analog signals to digital, ensuring precise output.

Maximum Linearity Error (EL): 0.0061035 %

The low linearity error percentage indicates that the conversion process is highly accurate, resulting in reliable digital output.

Sample Rate: 25 MHz

The high sample rate of 25 MHz allows for fast and efficient conversion of analog signals to digital, making this ADC suitable for applications requiring quick response times.

Maximum Analog Input Voltage: 3.2 V

The high maximum analog input voltage of 3.2 V provides versatility in accepting a wide range of input signals, making this ADC compatible with various applications.

Technical Specifications

Analog-to-Digital Converters ADC3682IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

18

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061035 %

Sample Rate:

25 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

46 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3682IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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