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ADC3661IRSBR

Texas Instruments

ADC3661IRSBR by Texas Instruments

Texas Instruments ADC3661IRSBR is a 16-bit ADC with 0.00762% linearity error, 10 MHz sample rate, and 2 analog input channels. Ideal for applications requiring high precision data conversion in compact spaces due to its small form factor and low power consumption.

Median Price

$53.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,634 parts In-Stock

1+ parts

$53.550

100+ parts

$47.600

1k+ parts

$35.000

10k+ parts

-

10,634

$53.550

$47.600

$35.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,305 parts In-Stock

1+ parts

$50.872

100+ parts

-

1k+ parts

-

10k+ parts

-

3,305

$50.872

-

-

-

Vyrian

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,360

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 599 parts In-Stock

1+ parts

$12.720

100+ parts

-

1k+ parts

-

10k+ parts

-

599

$12.720

-

-

-

Semicontronic

India . 10,482 parts In-Stock

1+ parts

$45.520

100+ parts

$44.382

1k+ parts

$44.154

10k+ parts

-

10,482

$45.520

$44.382

$44.154

-

Ampacity Inc.

Singapore . 10,168 parts In-Stock

1+ parts

$45.520

100+ parts

-

1k+ parts

-

10k+ parts

-

10,168

$45.520

-

-

-

Corphita

USA . 1,810 parts In-Stock

1+ parts

$48.195

100+ parts

-

1k+ parts

-

10k+ parts

-

1,810

$48.195

-

-

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Corohmni

South Africa . 471 parts In-Stock

1+ parts

$53.550

100+ parts

-

1k+ parts

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10k+ parts

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471

$53.550

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-

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Microchip USA

USA . 2,681 parts In-Stock

1+ parts

$100.630

100+ parts

$98.880

1k+ parts

$98.000

10k+ parts

$97.130

2,681

$100.630

$98.880

$98.000

$97.130

Northwest PG Solutions

USA . 1,130 parts In-Stock

1+ parts

-

100+ parts

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1,130

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Native Components

USA . 707 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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707

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Overview

Experience superior performance with the Texas Instruments ADC3661IRSBR Analog-to-Digital Converter. Crafted with precision and expertise, this product offers top-notch quality and reliability. With applications in various industries, this converter provides seamless integration and accurate results. Elevate your projects with the value and benefits that this innovative product brings, ensuring efficiency and excellence every step of the way. Choose Texas Instruments for unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, perfect for portable applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile input options and simultaneous sampling, making it suitable for multi-channel data acquisition systems.

Surface Mount: YES

The surface mount capability makes installation and integration easier, saving space on a circuit board and enabling automated assembly processes.

No. of Bits: 16

With 16 bits resolution, this ADC provides high accuracy and precision in converting analog signals into digital data, essential for applications requiring fine details.

Maximum Linearity Error (EL): 0.00762 %

The low linearity error ensures minimal distortion in the conversion process, resulting in accurate and reliable digital output.

No. of Terminals: 40

Having 40 terminals allows for versatile connectivity options and signal routing, making it suitable for complex data acquisition systems.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this ADC can function reliably even in harsh environments or industrial settings.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the ADC's performance and accuracy in extreme cold conditions, making it versatile and reliable in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold finish provides excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of the product.

Maximum Analog Input Voltage: 3.2 V

The high maximum analog input voltage range allows for compatibility with a wide range of input signals and signal levels, making it versatile in various applications.

Sample Rate: 10 MHz

With a high sample rate of 10 MHz, this ADC can capture and convert analog signals quickly and accurately, making it suitable for high-speed data acquisition requirements.

Output Format: SERIAL

The serial output format allows for easy integration with microcontrollers and digital systems, simplifying data processing and transmission.

Technical Specifications

Analog-to-Digital Converters ADC3661IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.00762 %

Sample Rate:

10 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

42 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3661IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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