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ADC3583IRSBR

Texas Instruments

ADC3583IRSBR by Texas Instruments

Texas Instruments ADC3583IRSBR is an 18-bit ADC with 0.00724% EL, 65 MHz sample rate, and 1.8V supply voltage. Ideal for industrial applications requiring high precision analog-to-digital conversion in a compact chip carrier package with surface mount capability.

Median Price

$102.410

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,485 parts In-Stock

1+ parts

$102.410

100+ parts

$99.330

1k+ parts

$77.000

10k+ parts

-

11,485

$102.410

$99.330

$77.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 121 parts In-Stock

1+ parts

$97.290

100+ parts

-

1k+ parts

-

10k+ parts

-

121

$97.290

-

-

-

Vyrian

USA . 7,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,047

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 746 parts In-Stock

1+ parts

$7.411

100+ parts

-

1k+ parts

$7.900

10k+ parts

-

746

$7.411

-

$7.900

-

ChromeModa Solutions

Germany . 928 parts In-Stock

1+ parts

$8.327

100+ parts

$6.828

1k+ parts

-

10k+ parts

-

928

$8.327

$6.828

-

-

IDEA Electronic Components Group

UK . 171 parts In-Stock

1+ parts

$8.327

100+ parts

$7.911

1k+ parts

$7.494

10k+ parts

-

171

$8.327

$7.911

$7.494

-

AZTECH Wire

Italy . 302 parts In-Stock

1+ parts

$21.730

100+ parts

-

1k+ parts

-

10k+ parts

-

302

$21.730

-

-

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Corphita

USA . 2,703 parts In-Stock

1+ parts

$92.169

100+ parts

-

1k+ parts

-

10k+ parts

-

2,703

$92.169

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-

-

Microchip USA

USA . 1,083 parts In-Stock

1+ parts

$154.960

100+ parts

$152.270

1k+ parts

$150.920

10k+ parts

$149.570

1,083

$154.960

$152.270

$150.920

$149.570

DigiPath Technology Company

USA . 1,302 parts In-Stock

1+ parts

-

100+ parts

$7.508

1k+ parts

-

10k+ parts

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1,302

-

$7.508

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Native Components

USA . 477 parts In-Stock

1+ parts

-

100+ parts

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477

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Northwest PG Solutions

USA . 240 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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240

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Overview

Unlock the potential of your analog-to-digital conversion needs with the Texas Instruments ADC3583IRSBR. This cutting-edge product boasts superior quality and reliability from a trusted manufacturer, ensuring top-notch performance in a variety of applications. Experience the value and benefits of this product through its precise conversion capabilities, efficient operation, and wide temperature range suitability. Elevate your projects with the ADC3583IRSBR and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for applications where weight and durability are important.

Surface Mount: YES

The surface mount capability allows for easy integration into PCBs, saving space and making assembly more efficient.

No. of Bits: 18

With 18 bits, this ADC provides high resolution for accurate conversion of analog signals to digital data.

Maximum Linearity Error (EL): 0.00724 %

The low linearity error ensures accurate conversion, making it suitable for precision measurement applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance in harsh environments with elevated temperatures.

Sample Rate: 65 MHz

The high sample rate enables fast and efficient conversion of analog signals, making it suitable for high-speed data acquisition systems.

Technical Specifications

Analog-to-Digital Converters ADC3583IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.00724 %

Sample Rate:

65 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

53 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3583IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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