Loading...

ADC3564IRSBR

Texas Instruments

ADC3564IRSBR by Texas Instruments

Texas Instruments ADC3564IRSBR is a 14-bit ADC with 0.0457763% EL, 125 MHz sample rate, and 1.8V supply voltage. Ideal for applications requiring high-speed data conversion in compact spaces due to its small form factor and low power consumption of 62mA at max.

Median Price

$66.500

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,620 parts In-Stock

1+ parts

$66.500

100+ parts

$64.500

1k+ parts

$50.000

10k+ parts

-

3,620

$66.500

$64.500

$50.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$50.000

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$50.000

-

-

-

Digiode

USA . 4,439 parts In-Stock

1+ parts

$63.175

100+ parts

-

1k+ parts

-

10k+ parts

-

4,439

$63.175

-

-

-

Vyrian

USA . 7,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,426

-

-

-

-

VNN

France . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,098 parts In-Stock

1+ parts

$14.790

100+ parts

-

1k+ parts

-

10k+ parts

-

1,098

$14.790

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$50.000

100+ parts

-

1k+ parts

$47.500

10k+ parts

$46.500

100

$50.000

-

$47.500

$46.500

Ampacity Inc.

Singapore . 3,513 parts In-Stock

1+ parts

$56.520

100+ parts

-

1k+ parts

-

10k+ parts

-

3,513

$56.520

-

-

-

Corphita

USA . 3,420 parts In-Stock

1+ parts

$59.850

100+ parts

-

1k+ parts

-

10k+ parts

-

3,420

$59.850

-

-

-

Microchip USA

USA . 2,049 parts In-Stock

1+ parts

$143.750

100+ parts

$141.250

1k+ parts

$140.000

10k+ parts

$138.750

2,049

$143.750

$141.250

$140.000

$138.750

Overview

Unlock precision and efficiency with the ADC3564IRSBR by Texas Instruments, a leading manufacturer known for top-quality Analog-to-Digital Converters. Ideal for a wide range of applications, this converter offers unparalleled value with its high performance and reliability. Experience seamless data conversion at lightning-fast speeds, ensuring accuracy and consistency in your projects. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds expectations. Elevate your work with the ADC3564IRSBR and revolutionize your digital processes today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable applications.

Surface Mount: YES

With surface mount capability, this product can easily be integrated into compact electronic devices, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, making this product suitable for applications with limited real estate.

No. of Bits: 14

This high number of bits results in high resolution and accuracy in converting analog signals to digital, making this product perfect for demanding precision applications.

Maximum Linearity Error (EL): 0.0457763%

The low maximum linearity error ensures accurate conversion of analog signals, making this product reliable for critical measurements.

No. of Terminals: 40

With a large number of terminals, this product offers flexibility in connectivity options, making it versatile for various system configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier style with heat sink/slug and very thin profile enhances thermal performance and allows for efficient heat dissipation, ensuring reliable operation.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range makes this product suitable for harsh environments and extended use without the risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures performance in cold conditions, making this product versatile for a wide range of operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and conductivity, ensuring long-term reliability and performance.

Terminal Position: QUAD

The quad terminal position offers convenient placement and soldering options, making this product easy to integrate into circuit designs.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a compact overall design, making this product suitable for slim profile devices.

Width: 5 mm

With a narrow width, this product can be easily accommodated in tight spaces, ideal for applications with size constraints.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joint formation during assembly, enhancing the overall quality and durability of the product.

Length: 5 mm

The short length of this product contributes to its compact design, making it suitable for applications where space is limited.

Maximum Analog Input Voltage: 3.2 V

The high maximum analog input voltage range allows for compatibility with a wide variety of signal sources, increasing the product's versatility.

Sample Rate: 125 MHz

The high sample rate enables fast and accurate conversion of analog signals, making this product suitable for high-speed data acquisition applications.

Terminal Form: NO LEAD

The no lead terminal form simplifies the manufacturing process and reduces the risk of solder defects, ensuring consistent product quality.

Maximum Supply Current: 62 mA

The low maximum supply current consumption helps optimize power efficiency, making this product energy-efficient and suitable for battery-operated devices.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC method used in this product enhances performance and accuracy in analog-to-digital conversion, making it a reliable choice for precise measurements.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage requirement reduces power consumption and extends battery life, making this product suitable for portable and low-power applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The output bit code options provide flexibility in data representation, allowing for compatibility with various systems and protocols.

Terminal Pitch: 0.4 mm

The small terminal pitch enables high-density mounting, optimizing board space usage and supporting compact system designs.

Minimum Analog Input Voltage: -3.2 V

The low minimum analog input voltage acceptance range ensures compatibility with a wide variety of signal sources, enhancing the product's flexibility.

Output Format: SERIAL

The serial output format simplifies data transmission and processing, making this product suitable for digital communication interfaces.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's resistance to moisture-related damage, ensuring reliability in humid or damp environments.

Technical Specifications

Analog-to-Digital Converters ADC3564IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0457763 %

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

62 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3564IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20