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ADC3562IRSBT

Texas Instruments

ADC3562IRSBT by Texas Instruments

Texas Instruments ADC3562IRSBT is a 16-bit ADC with 0.007629395% EL, 25 MHz sample rate, and 1.8V supply voltage. Ideal for applications requiring high precision analog-to-digital conversion in compact spaces due to its small form factor and low power consumption of 27mA at max.

Median Price

$67.470

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,892 parts In-Stock

1+ parts

$47.430

100+ parts

$42.160

1k+ parts

$31.000

10k+ parts

-

1,892

$47.430

$42.160

$31.000

-

DigiKey

USA . 465 parts In-Stock

1+ parts

$67.470

100+ parts

$49.802

1k+ parts

$48.286

10k+ parts

-

465

$67.470

$49.802

$48.286

-

Mouser Electronics

USA . 220 parts In-Stock

1+ parts

$67.470

100+ parts

$49.810

1k+ parts

$48.280

10k+ parts

-

220

$67.470

$49.810

$48.280

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 606 parts In-Stock

1+ parts

$45.058

100+ parts

-

1k+ parts

-

10k+ parts

-

606

$45.058

-

-

-

Vyrian

USA . 8,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,151

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 995 parts In-Stock

1+ parts

$2.075

100+ parts

-

1k+ parts

-

10k+ parts

-

995

$2.075

-

-

-

Northwest PG Solutions

USA . 1,556 parts In-Stock

1+ parts

$2.282

100+ parts

-

1k+ parts

-

10k+ parts

-

1,556

$2.282

-

-

-

Corohmni

South Africa . 156 parts In-Stock

1+ parts

$39.130

100+ parts

-

1k+ parts

-

10k+ parts

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156

$39.130

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-

-

Corphita

USA . 4,640 parts In-Stock

1+ parts

$42.687

100+ parts

-

1k+ parts

-

10k+ parts

-

4,640

$42.687

-

-

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Semicontronic

India . 693 parts In-Stock

1+ parts

$72.390

100+ parts

$70.580

1k+ parts

$70.218

10k+ parts

-

693

$72.390

$70.580

$70.218

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Ampacity Inc.

Singapore . 598 parts In-Stock

1+ parts

$72.390

100+ parts

-

1k+ parts

-

10k+ parts

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598

$72.390

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-

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Overview

Unlock the power of precision with the Texas Instruments ADC3562IRSBT Analog-to-Digital Converter. Designed with quality in mind, this innovative chip carrier offers unparalleled performance and reliability for a wide range of applications. From industrial automation to medical imaging, this versatile converter delivers exceptional accuracy and speed, allowing you to capture data with ease. With its very thin profile and surface mount capabilities, the ADC3562IRSBT is the perfect solution for your analog-to-digital conversion needs. Upgrade your devices today and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the converter.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and reducing assembly time.

No. of Bits: 16

This high number of bits allows for precise and accurate conversion of analog signals to digital, making it suitable for applications requiring high resolution.

Maximum Linearity Error (EL): 0.007629395 %

The low linearity error ensures that the output digital values closely match the input analog signal, resulting in accurate conversion.

No. of Terminals: 40

The 40 terminals provide multiple connection points for input and output signals, enabling versatile usage in various circuit configurations.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures the converter can function in extreme cold conditions as well.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Analog Input Voltage: 3.2 V

The high maximum analog input voltage range allows for compatibility with a wide range of input signal levels.

Sample Rate: 25 MHz

The high sample rate enables fast and efficient conversion of analog signals into digital format, suitable for real-time applications.

Output Format: SERIAL

The serial output format simplifies data transmission and integration with other digital systems.

Technical Specifications

Analog-to-Digital Converters ADC3562IRSBT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

2’s Complement, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.007629395 %

Sample Rate:

25 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

27 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3562IRSBT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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