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ADC3441IRTQ25

Texas Instruments

ADC3441IRTQ25 by Texas Instruments

Texas Instruments ADC3441IRTQ25 is a 14-bit ADC with 4 analog channels, operating at 25 MHz sample rate. Ideal for industrial applications, it has a temperature range of -40 to 85°C and supports input voltages from -2V to +2V. The package style is chip carrier with a very thin profile, making it suitable for space-constrained designs.

Median Price

$1.788

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 14 parts In-Stock

1+ parts

$1.788

100+ parts

-

1k+ parts

-

10k+ parts

-

14

$1.788

-

-

-

Verical

USA . 14 parts In-Stock

1+ parts

$45.450

100+ parts

-

1k+ parts

-

10k+ parts

-

14

$45.450

-

-

-

Chip1Stop

Japan . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.770

10k+ parts

-

14

-

-

$1.770

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 286 parts In-Stock

1+ parts

$1.699

100+ parts

-

1k+ parts

-

10k+ parts

-

286

$1.699

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$44.678

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$44.678

-

-

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Vyrian

USA . 6,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,828

-

-

-

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VNN

France . 4,287 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,287

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

-

14

$1.500

-

-

-

Corphita

USA . 666 parts In-Stock

1+ parts

$1.609

100+ parts

-

1k+ parts

-

10k+ parts

-

666

$1.609

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-

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AZTECH Wire

Italy . 337 parts In-Stock

1+ parts

$7.551

100+ parts

-

1k+ parts

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10k+ parts

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337

$7.551

-

-

-

Parana Technologies

USA . 2,081 parts In-Stock

1+ parts

$24.259

100+ parts

-

1k+ parts

$24.915

10k+ parts

-

2,081

$24.259

-

$24.915

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DigiPath Technology Company

USA . 2,129 parts In-Stock

1+ parts

$26.712

100+ parts

$24.575

1k+ parts

-

10k+ parts

-

2,129

$26.712

$24.575

-

-

ChromeModa Solutions

Germany . 3,423 parts In-Stock

1+ parts

$27.257

100+ parts

$22.351

1k+ parts

-

10k+ parts

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3,423

$27.257

$22.351

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IDEA Electronic Components Group

UK . 1,243 parts In-Stock

1+ parts

$27.257

100+ parts

$25.894

1k+ parts

$24.531

10k+ parts

-

1,243

$27.257

$25.894

$24.531

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$44.678

100+ parts

-

1k+ parts

$42.444

10k+ parts

$41.550

2,000

$44.678

-

$42.444

$41.550

Microchip USA

USA . 347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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347

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Overview

Discover the Texas Instruments ADC3441IRTQ25, a cutting-edge Analog-to-Digital Converter that offers uncompromising quality and reliability. Manufactured by industry leader Texas Instruments, this product boasts a robust design and innovative technology. With a wide range of applications in industries such as automotive, industrial automation, and telecommunications, the ADC3441IRTQ25 delivers exceptional performance and accuracy. Experience seamless integration and precise data conversion with this versatile solution. Upgrade your systems today and unlock a world of possibilities with the Texas Instruments ADC3441IRTQ25.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable devices.

No. of Analog In Channels: 4

With 4 input channels, this product offers versatility and flexibility in signal processing applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards.

Package Shape: SQUARE

The square shape saves space on PCBs, making it suitable for compact designs.

No. of Bits: 14

A high number of bits provides high resolution and accuracy in signal conversion.

No. of Terminals: 56

The numerous terminals enable easy connections and signal routing in complex systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures efficient heat dissipation and compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes the product suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and allows for easier assembly.

Maximum Seated Height: 1 mm

The low seated height saves space on the PCB and reduces overall system size.

Width: 8 mm

The compact width allows for efficient use of space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes the chances of thermal damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder connections in manufacturing processes.

Length: 8 mm

The short length facilitates compact PCB designs and saves space.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and performance under harsh conditions.

Maximum Analog Input Voltage: 2 V

The high input voltage range allows for versatile signal processing capabilities.

Sample Rate: 25 MHz

A high sample rate enables fast and accurate data conversion in real-time applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and assembly processes.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC method ensures efficient and accurate analog-to-digital conversion.

Nominal Supply Voltage: 1.8 V

The low supply voltage requirement reduces power consumption and heat generation.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Multiple output bit code options allow for flexible data processing and integration with different systems.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting for space-saving designs.

Minimum Analog Input Voltage: -2 V

The negative input voltage range allows for versatile signal handling capabilities.

Output Format: SERIAL

The serial output format simplifies data transmission and integration with digital systems.

Moisture Sensitivity Level (MSL): 3

The MSL requirement ensures the product's reliability in humid environments.

Technical Specifications

Analog-to-Digital Converters ADC3441IRTQ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

25 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Trade Compliance

ADC3441IRTQ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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