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ADC32RF55IRTDT

Texas Instruments

ADC32RF55IRTDT by Texas Instruments

Texas Instruments ADC32RF55IRTDT is a 14-bit ADC with 2 analog in channels, operating at a max temp of 85°C. It offers a sample rate of 3000 MHz and output format is serial. Ideal for applications requiring high-speed data conversion like telecommunications and radar systems.

Median Price

$1,864.800

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 745 parts In-Stock

1+ parts

$1,864.800

100+ parts

$1,709.400

1k+ parts

$1,554.000

10k+ parts

-

745

$1,864.800

$1,709.400

$1,554.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,485 parts In-Stock

1+ parts

$1,771.560

100+ parts

-

1k+ parts

-

10k+ parts

-

3,485

$1,771.560

-

-

-

Vyrian

USA . 3,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,782

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 467 parts In-Stock

1+ parts

$0.087

100+ parts

-

1k+ parts

-

10k+ parts

$0.084

467

$0.087

-

-

$0.084

Northwest PG Solutions

USA . 1,282 parts In-Stock

1+ parts

$0.096

100+ parts

-

1k+ parts

-

10k+ parts

$0.084

1,282

$0.096

-

-

$0.084

Microchip USA

USA . 1,901 parts In-Stock

1+ parts

$1.000

100+ parts

$915.310

1k+ parts

$891.220

10k+ parts

$867.130

1,901

$1.000

$915.310

$891.220

$867.130

Semicontronic

India . 370 parts In-Stock

1+ parts

$1,585.080

100+ parts

$1,545.453

1k+ parts

$1,537.528

10k+ parts

-

370

$1,585.080

$1,545.453

$1,537.528

-

Ampacity Inc.

Singapore . 164 parts In-Stock

1+ parts

$1,585.080

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$1,585.080

-

-

-

Corphita

USA . 3,004 parts In-Stock

1+ parts

$1,678.320

100+ parts

-

1k+ parts

-

10k+ parts

-

3,004

$1,678.320

-

-

-

Corohmni

South Africa . 332 parts In-Stock

1+ parts

$1,864.800

100+ parts

-

1k+ parts

-

10k+ parts

-

332

$1,864.800

-

-

-

Overview

Unlock the power of precision with the ADC32RF55IRTDT by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments ensures top-notch quality and reliability in every product. Ideal for a wide range of applications, this converter offers unmatched value and performance. With advanced features and a compact design, customers can trust in the accuracy and efficiency of this cutting-edge technology. Experience seamless integration and superior results with the ADC32RF55IRTDT from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good protection and insulation for the internal circuitry.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more flexibility in connecting different sources for conversion, making this product versatile.

Surface Mount: YES

Surface mount design makes it easier to integrate this ADC into PCBs for compact and efficient layouts.

No. of Bits: 14

A higher number of bits means higher resolution and accuracy in the conversion process, making this ADC suitable for applications requiring precise measurements.

Maximum Linearity Error (EL): 0.024414 %

Low linearity error ensures that the output values closely match the input values, leading to more accurate conversion results.

No. of Terminals: 76

Having a higher number of terminals allows for more connectivity options and functionalities in the overall system design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier packaging with heat sink and very thin profile makes this ADC suitable for applications where space and heat dissipation are critical factors.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this ADC can withstand higher temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 to 85°C allows this ADC to function in extreme environments, ensuring reliability in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the ADC.

Maximum Analog Input Voltage: 1.1 V

Supporting an input voltage of up to 1.1V allows for compatibility with a wide range of analog signals, making this ADC versatile for different applications.

Sample Rate: 3000 MHz

The high sample rate of 3000 MHz enables fast and efficient conversion of analog signals, suitable for high-speed data acquisition and processing.

Terminal Position: QUAD

Quad terminal positioning provides stability and ease of connection during installation, ensuring proper functionality of the ADC.

Converter Type: ADC, PROPRIETARY METHOD

The use of proprietary conversion methods enhances the performance and efficiency of the ADC, giving it a competitive edge in terms of accuracy and speed.

Nominal Supply Voltage: 1.2 V

With a nominal supply voltage of 1.2V, this ADC can operate efficiently with low power consumption, making it suitable for battery-powered devices.

Output Bit Code: 2S COMPLEMENT, OFFSET BINARY

The use of 2S complement and offset binary coding ensures compatibility with different digital systems, allowing for seamless integration of the ADC output.

Terminal Pitch: 0.5 mm

Having a small terminal pitch of 0.5mm enables high-density connections in compact PCB designs, making this ADC suitable for space-constrained applications.

Minimum Analog Input Voltage: -1.1 V

Supporting negative input voltage up to -1.1V allows for wider range of analog signals to be converted, increasing the versatility of this ADC.

Output Format: SERIAL

Serial output format simplifies data transmission and interfacing with digital systems, enhancing the usability and compatibility of the ADC.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this ADC can withstand moderate exposure to moisture during handling and assembly processes, ensuring long-term reliability.

Technical Specifications

Analog-to-Digital Converters ADC32RF55IRTDT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

2’s Complement, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.024414 %

Sample Rate:

3000 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-1.1 V

Maximum Analog Input Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

76

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.038 in (0.975 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC76,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N76

JESD-609 Code:

e4

Trade Compliance

ADC32RF55IRTDT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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