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ADC32J23IRGZR

Texas Instruments

ADC32J23IRGZR by Texas Instruments

Texas Instruments ADC32J23IRGZR is a 12-bit ADC with 2 analog in channels, operating from -40 to 85°C. It has a sample rate of 160 MHz and supports serial output format. Ideal for industrial applications requiring high-speed data conversion in compact spaces.

Median Price

$23.845

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,450 parts In-Stock

1+ parts

$23.845

100+ parts

$21.196

1k+ parts

$15.585

10k+ parts

-

2,450

$23.845

$21.196

$15.585

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 823 parts In-Stock

1+ parts

$22.653

100+ parts

-

1k+ parts

-

10k+ parts

-

823

$22.653

-

-

-

Vyrian

USA . 5,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,071

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 952 parts In-Stock

1+ parts

$0.045

100+ parts

-

1k+ parts

-

10k+ parts

$0.043

952

$0.045

-

-

$0.043

AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$11.950

100+ parts

-

1k+ parts

-

10k+ parts

-

564

$11.950

-

-

-

Parana Technologies

USA . 1,344 parts In-Stock

1+ parts

$17.082

100+ parts

-

1k+ parts

$17.299

10k+ parts

-

1,344

$17.082

-

$17.299

-

DigiPath Technology Company

USA . 17 parts In-Stock

1+ parts

$18.809

100+ parts

-

1k+ parts

-

10k+ parts

-

17

$18.809

-

-

-

ChromeModa Solutions

Germany . 5,737 parts In-Stock

1+ parts

$19.193

100+ parts

$15.738

1k+ parts

-

10k+ parts

-

5,737

$19.193

$15.738

-

-

IDEA Electronic Components Group

UK . 567 parts In-Stock

1+ parts

$19.193

100+ parts

$18.233

1k+ parts

$17.274

10k+ parts

-

567

$19.193

$18.233

$17.274

-

Corphita

USA . 3,350 parts In-Stock

1+ parts

$21.460

100+ parts

-

1k+ parts

-

10k+ parts

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3,350

$21.460

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-

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Microchip USA

USA . 5,118 parts In-Stock

1+ parts

$47.670

100+ parts

$46.850

1k+ parts

$46.430

10k+ parts

$46.020

5,118

$47.670

$46.850

$46.430

$46.020

Northwest PG Solutions

USA . 572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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572

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-

-

-

Overview

Experience superior data conversion with the ADC32J23IRGZR by Texas Instruments. Known for their unparalleled quality and expertise, Texas Instruments delivers cutting-edge Analog-to-Digital Converters that offer precision and reliability. Ideal for industrial applications, this product ensures accurate conversion of analog signals to digital data, providing customers with valuable insights and efficiency. Trust Texas Instruments for high-performance solutions that drive innovation and success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for long-term use.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more versatile input options.

Surface Mount: YES

Surface mounting makes installation easier and more space-efficient.

No. of Bits: 12

With 12 bits, this converter provides high resolution for accurate data conversion.

No. of Terminals: 48

The numerous terminals allow for versatile connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The high-quality terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position allows for easy integration and connectivity.

Maximum Seated Height: 1 mm

Low seated height enables compact device design.

Width: 7 mm

Compact width allows for space-efficient placement in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with short time duration for quick assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering connections.

Length: 7 mm

Compact length for space-efficient device design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable performance in harsh conditions.

Maximum Analog Input Voltage: 2 V

High maximum analog input voltage allows for versatile input compatibility.

Sample Rate: 160 MHz

High sample rate enables fast and accurate data conversion.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly design.

Converter Type: ADC, PROPRIETARY METHOD

Proprietary conversion method ensures high-quality and customized performance.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent and reliable operation.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Various output bit code options for flexible data output formats.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connectivity and integration.

Minimum Analog Input Voltage: -2 V

Low minimum analog input voltage allows for versatile input signal compatibility.

Output Format: SERIAL

Serial output format for efficient data transmission.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for safe and reliable performance.

Technical Specifications

Analog-to-Digital Converters ADC32J23IRGZR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

160 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC32J23IRGZR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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