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ADC3224IRGZ25

Texas Instruments

ADC3224IRGZ25 by Texas Instruments

Texas Instruments ADC3224IRGZ25 is a 12-bit ADC with 2 analog in channels, operating at 125 MHz sample rate. Ideal for industrial applications, it offers a max analog input voltage of ±2V and operates b/w -40 to 85°C. Package style includes chip carrier and very thin profile, making it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,199 parts In-Stock

1+ parts

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4,199

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Vyrian

USA . 435 parts In-Stock

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435

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 17 parts In-Stock

1+ parts

$0.032

100+ parts

-

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-

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$0.031

17

$0.032

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$0.031

One Stop Electronics

USA . 363 parts In-Stock

1+ parts

$11.000

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-

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363

$11.000

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AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$14.529

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570

$14.529

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Parana Technologies

USA . 2,251 parts In-Stock

1+ parts

$17.555

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$17.750

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2,251

$17.555

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$17.750

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ChromeModa Solutions

Germany . 1,657 parts In-Stock

1+ parts

$19.725

100+ parts

$16.174

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1,657

$19.725

$16.174

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IDEA Electronic Components Group

UK . 287 parts In-Stock

1+ parts

$19.725

100+ parts

$18.739

1k+ parts

$17.752

10k+ parts

-

287

$19.725

$18.739

$17.752

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Corphita

USA . 2,329 parts In-Stock

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2,329

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DigiPath Technology Company

USA . 1,702 parts In-Stock

1+ parts

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$17.784

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1,702

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$17.784

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Northwest PG Solutions

USA . 1,532 parts In-Stock

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1,532

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Microchip USA

USA . 134 parts In-Stock

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134

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Overview

Experience the superior performance and precision of the Texas Instruments ADC3224IRGZ25 Analog-to-Digital Converter. With a reputation for excellence in manufacturing, Texas Instruments delivers top-quality products that exceed industry standards. This ADC is perfect for applications requiring high-speed data conversion with its 125 MHz sample rate. Its compact square package design makes it ideal for space-constrained environments. Trust in Texas Instruments to provide you with reliable solutions for your analog-to-digital conversion needs, ensuring optimal functionality and accuracy every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection and reliability for the converter, making it suitable for various applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for multiple input sources to be processed simultaneously, increasing versatility.

Surface Mount: YES

Surface mount capability makes installation and integration of the converter easier and more efficient.

No. of Bits: 12

12 bits of resolution provide accuracy and precision in converting analog signals to digital, making it ideal for high-quality digitalization.

No. of Terminals: 48

With 48 terminals, the converter offers a range of connection options for flexibility and compatibility with different systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage requirement makes the converter energy-efficient and suitable for low-power applications.

Sample Rate: 125 MHz

A high sample rate allows for fast and accurate conversion of analog signals to digital, making it suitable for real-time data processing.

Technical Specifications

Analog-to-Digital Converters ADC3224IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC3224IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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