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ADC3222IRGZR

Texas Instruments

ADC3222IRGZR by Texas Instruments

Texas Instruments ADC3222IRGZR is a 12-bit ADC with 2 analog in channels, operating at 125 MHz sample rate. It has a max analog input voltage of ±2V and output format is serial. Widely used in industrial applications due to its high performance and compact chip carrier package style.

Median Price

$15.817

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,528 parts In-Stock

1+ parts

$15.817

100+ parts

$14.060

1k+ parts

$10.338

10k+ parts

-

10,528

$15.817

$14.060

$10.338

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 479 parts In-Stock

1+ parts

$15.026

100+ parts

-

1k+ parts

-

10k+ parts

-

479

$15.026

-

-

-

Vyrian

USA . 4,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,799

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 733 parts In-Stock

1+ parts

$0.421

100+ parts

-

1k+ parts

-

10k+ parts

$0.404

733

$0.421

-

-

$0.404

Northwest PG Solutions

USA . 949 parts In-Stock

1+ parts

$0.463

100+ parts

-

1k+ parts

-

10k+ parts

$0.408

949

$0.463

-

-

$0.408

Parana Technologies

USA . 1,146 parts In-Stock

1+ parts

$4.816

100+ parts

-

1k+ parts

$5.329

10k+ parts

-

1,146

$4.816

-

$5.329

-

DigiPath Technology Company

USA . 1,332 parts In-Stock

1+ parts

$5.303

100+ parts

$4.879

1k+ parts

-

10k+ parts

-

1,332

$5.303

$4.879

-

-

ChromeModa Solutions

Germany . 3,838 parts In-Stock

1+ parts

$5.411

100+ parts

$4.437

1k+ parts

-

10k+ parts

-

3,838

$5.411

$4.437

-

-

IDEA Electronic Components Group

UK . 1,431 parts In-Stock

1+ parts

$5.411

100+ parts

-

1k+ parts

$4.870

10k+ parts

-

1,431

$5.411

-

$4.870

-

AZTECH Wire

Italy . 932 parts In-Stock

1+ parts

$9.530

100+ parts

-

1k+ parts

-

10k+ parts

-

932

$9.530

-

-

-

Corphita

USA . 1,029 parts In-Stock

1+ parts

$14.235

100+ parts

-

1k+ parts

-

10k+ parts

-

1,029

$14.235

-

-

-

Component Stockers USA

USA . 175 parts In-Stock

1+ parts

$219.330

100+ parts

-

1k+ parts

-

10k+ parts

-

175

$219.330

-

-

-

Overview

Elevate your analog-to-digital conversion with the Texas Instruments ADC3222IRGZR. Crafted with precision by a top-tier manufacturer, this innovative converter offers unparalleled quality and reliability. Perfect for a range of applications, from industrial to consumer electronics, this ADC delivers exceptional performance, accuracy, and efficiency. Experience the value of seamless integration, advanced features, and superior design in a compact, versatile package. Unlock the potential of your projects with the ADC3222IRGZR and see your ideas come to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external factors, ensuring long-term reliability.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple input sources to the converter.

Surface Mount: YES

The surface mount feature makes installation and integration of the converter easier and more convenient.

No. of Bits: 12

With 12 bits, the converter can provide a high level of precision and accuracy in converting analog signals to digital.

No. of Terminals: 48

The 48 terminals provide ample connectivity options, allowing for smooth integration into various circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the converter can function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The converter's ability to operate at temperatures as low as -40°C makes it suitable for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of nickel, palladium, gold, and silver for terminal finish ensures good conductivity and corrosion resistance, enhancing the converter's longevity.

Terminal Position: QUAD

The quad terminal position allows for efficient connectivity and easy mounting on circuit boards, streamlining the installation process.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm helps in minimizing the overall size of the converter and contributes to a compact design.

Width: 7 mm

The 7mm width makes the converter suitable for applications where space is a constraint, enabling easy integration into compact systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 30 seconds ensures proper soldering and prevents damage to the converter during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering of the converter on PCBs, ensuring secure attachment.

Length: 7 mm

With a length of 7mm, the converter maintains a compact form factor, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance of the converter in harsh industrial environments with varying temperature conditions.

Maximum Analog Input Voltage: 2 V

The maximum analog input voltage capability of 2V allows for handling a wide range of input signals, making the converter versatile.

Sample Rate: 125 MHz

A high sample rate of 125 MHz enables the converter to capture and process analog signals rapidly, facilitating real-time data acquisition.

Terminal Form: NO LEAD

The no lead terminal form simplifies the soldering process and contributes to environmental sustainability by eliminating lead usage.

Converter Type: ADC, PROPRIETARY METHOD

The use of proprietary ADC method ensures optimized conversion accuracy and performance, giving a competitive edge to the converter.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V ensures efficient power consumption and compatibility with a wide range of power sources.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for both offset binary and 2's complement binary output bit codes provides flexibility in data representation, catering to different application requirements.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting of the converter on PCBs, optimizing space utilization.

Minimum Analog Input Voltage: -2 V

The ability to handle analog input voltages as low as -2V makes the converter suitable for applications where negative voltage signals are involved.

Output Format: SERIAL

The serial output format simplifies data transmission and interfacing with other digital systems, enhancing the converter's compatibility.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the converter has moderate sensitivity to moisture, making it suitable for use in various environmental conditions.

Technical Specifications

Analog-to-Digital Converters ADC3222IRGZR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC3222IRGZR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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