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74CBTLV3253DGVRE4

Texas Instruments

74CBTLV3253DGVRE4 by Texas Instruments

74CBTLV3253DGVRE4 by Texas Instruments is a CMOS multiplexer/demultiplexer with 2 functions, 16 terminals, and 0.25 ns propagation delay. It operates at a supply voltage of 2.5/3.3 V and has a temperature range of -40 to 85 °C. Ideal for industrial applications requiring compact design and fast signal switching.

Median Price

$0.402

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

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$0.358

1k+ parts

$0.297

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$0.265

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-

$0.358

$0.297

$0.265

DigiKey

USA . 1,000 parts In-Stock

1+ parts

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$0.450

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$0.450

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Verical

USA . 1,000 parts In-Stock

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$0.402

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$0.331

1,000

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$0.402

$0.331

Distributors (In-Stock)

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Digiode

USA . 1,749 parts In-Stock

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$0.277

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$0.277

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Vyrian

USA . 3,616 parts In-Stock

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DigiKey Marketplace

USA . 1,000 parts In-Stock

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$0.300

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$0.300

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Bristol Electronics

USA . 35 parts In-Stock

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$0.536

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$0.536

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Microfarads

USA . 34 parts In-Stock

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34

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Distributors (Availability)

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Corphita

USA . 4,506 parts In-Stock

1+ parts

$0.263

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$0.263

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Native Components

USA . 369 parts In-Stock

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$1.858

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369

$1.858

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Northwest PG Solutions

USA . 974 parts In-Stock

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$2.043

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974

$2.043

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Parana Technologies

USA . 240 parts In-Stock

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$23.160

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$23.795

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240

$23.160

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$23.795

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DigiPath Technology Company

USA . 154 parts In-Stock

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$25.503

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$23.462

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$25.503

$23.462

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ChromeModa Solutions

Germany . 2,827 parts In-Stock

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$26.023

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$21.339

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2,827

$26.023

$21.339

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IDEA Electronic Components Group

UK . 67 parts In-Stock

1+ parts

$26.023

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$24.722

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$23.421

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67

$26.023

$24.722

$23.421

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QUARKTWIN TECHNOLOGY LTD

USA . 27,813 parts In-Stock

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Perfect Parts

USA . 2,128 parts In-Stock

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Overview

Enhance your electronic projects with the 74CBTLV3253DGVRE4 by Texas Instruments, a high-quality multiplexer & demultiplexer that offers exceptional performance and reliability. Manufactured by the renowned Texas Instruments, this versatile component is perfect for applications requiring precision and efficiency. With its compact design and advanced technology, this product delivers value and benefits to customers by providing seamless integration, fast propagation delay, and wide operating temperature range. Upgrade your projects today with the Texas Instruments 74CBTLV3253DGVRE4 for unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy integration of this product onto PCBs, saving space and simplifying assembly.

No. of Functions: 2

With 2 functions in one device, this multiplexer/demultiplexer offers added functionality and versatility for signal routing and processing.

Propagation Delay (tpd): 0.25 ns

The low propagation delay ensures fast signal processing, making this product suitable for high-speed applications where timing is critical.

Output Characteristics: 3-STATE

The 3-STATE output feature allows for flexible output control, enabling the device to drive multiple loads without interference when not in use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for long-term use.

Technical Specifications

Multiplexer & Demultiplexer 74CBTLV3253DGVRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Outputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.6 mm

Trade Compliance

74CBTLV3253DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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