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74AVCB164245GRDR

Texas Instruments

74AVCB164245GRDR by Texas Instruments

74AVCB164245GRDR by Texas Instruments is a bus driver & transceiver with 8 bits and 2 functions. It operates at a nominal voltage of 1.5V, translating b/w 1.5/3.3V power supplies. With a propagation delay of 6.8 ns, it is ideal for industrial applications requiring bidirectional control in a compact package style.

Median Price

$3.750

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$3.750

1k+ parts

$3.360

10k+ parts

$3.160

11

-

$3.750

$3.360

$3.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 307 parts In-Stock

1+ parts

$3.962

100+ parts

-

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-

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307

$3.962

-

-

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Vyrian

USA . 7,212 parts In-Stock

1+ parts

-

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7,212

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VNN

France . 1,961 parts In-Stock

1+ parts

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1,961

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

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-

11

$3.540

-

-

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Corphita

USA . 4,117 parts In-Stock

1+ parts

$3.753

100+ parts

-

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4,117

$3.753

-

-

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AZTECH Wire

Italy . 618 parts In-Stock

1+ parts

$8.091

100+ parts

-

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618

$8.091

-

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Parana Technologies

USA . 1,897 parts In-Stock

1+ parts

$19.317

100+ parts

-

1k+ parts

$19.340

10k+ parts

-

1,897

$19.317

-

$19.340

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DigiPath Technology Company

USA . 244 parts In-Stock

1+ parts

$21.271

100+ parts

-

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244

$21.271

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ChromeModa Solutions

Germany . 3,419 parts In-Stock

1+ parts

$21.705

100+ parts

$17.798

1k+ parts

-

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3,419

$21.705

$17.798

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IDEA Electronic Components Group

UK . 1,246 parts In-Stock

1+ parts

$21.705

100+ parts

$20.620

1k+ parts

$19.534

10k+ parts

-

1,246

$21.705

$20.620

$19.534

-

Corohmni

South Africa . 304 parts In-Stock

1+ parts

$25.035

100+ parts

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304

$25.035

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Continental Prestige Electronics

USA . 2,429 parts In-Stock

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2,429

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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1,970

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Argo Parts USA

USA . 763 parts In-Stock

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763

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Microchip USA

USA . 298 parts In-Stock

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298

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Unleash the power of seamless data transmission with the 74AVCB164245GRDR by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This bus driver & transceiver is perfect for various applications, providing fast propagation delay and versatile voltage translation capabilities. Say goodbye to compatibility issues and hello to smooth communication with this innovative product. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides durability and protection for the internal components of the bus driver/transceiver.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in a single device reduces the need for additional components, leading to cost savings and improved efficiency.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to handle, making it compatible with standard PCB designs.

No. of Bits: 8

8 bits of data transmission capacity provide flexibility and versatility in handling various types of signals.

Translation: 1.5/3.3V&1.5/3.3V

Support for multiple voltage translation options allows for seamless communication between different voltage domains in a system.

Nominal Supply Voltage / Vsup (V): 1.5

Stable supply voltage of 1.5V ensures consistent performance of the bus driver/transceiver.

Power Supplies (V): 1.5/3.3

Compatibility with both 1.5V and 3.3V power supplies enables flexible integration into a variety of electronic systems.

No. of Terminals: 54

Having 54 terminals allows for multiple connections and signal paths, increasing the functionality of the device.

Technical Specifications

Bus Driver & Transceivers 74AVCB164245GRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e0

Length:

8 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

240

Power Supplies (V):

1.5/3.3

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Translation:

1.5/3.3V&1.5/3.3V

Width:

5.5 mm

Trade Compliance

74AVCB164245GRDR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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