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74AUC1G240DBVRG4

Texas Instruments

74AUC1G240DBVRG4 by Texas Instruments

74AUC1G240DBVRG4 by Texas Instruments is a TTL technology bus driver with 3.3 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 1.2V and has a load capacitance of 15pF, making it ideal for low-power circuits requiring fast signal transmission. With a compact package style and surface-mount capability, this device offers efficient performance in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,040 parts In-Stock

1+ parts

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6,040

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Digiode

USA . 1,484 parts In-Stock

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1,484

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Distributors (Availability)

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Andel Nordic

Denmark . 472 parts In-Stock

1+ parts

$5.230

100+ parts

-

1k+ parts

$5.021

10k+ parts

$5.021

472

$5.230

-

$5.021

$5.021

Native Components

USA . 778 parts In-Stock

1+ parts

$10.040

100+ parts

-

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778

$10.040

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Northwest PG Solutions

USA . 1,417 parts In-Stock

1+ parts

$11.044

100+ parts

$9.940

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1,417

$11.044

$9.940

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AZTECH Wire

Italy . 873 parts In-Stock

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$14.485

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873

$14.485

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Parana Technologies

USA . 1,288 parts In-Stock

1+ parts

$22.624

100+ parts

$2,100.963

1k+ parts

$20.361

10k+ parts

-

1,288

$22.624

$2,100.963

$20.361

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DigiPath Technology Company

USA . 472 parts In-Stock

1+ parts

$24.912

100+ parts

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472

$24.912

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ChromeModa Solutions

Germany . 1,578 parts In-Stock

1+ parts

$25.420

100+ parts

$20.844

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1,578

$25.420

$20.844

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IDEA Electronic Components Group

UK . 1,517 parts In-Stock

1+ parts

$25.420

100+ parts

$24.149

1k+ parts

$22.878

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1,517

$25.420

$24.149

$22.878

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One Stop Electronics

USA . 934 parts In-Stock

1+ parts

$37.000

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934

$37.000

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Perfect Parts

USA . 6,615 parts In-Stock

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6,615

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Corphita

USA . 3,775 parts In-Stock

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Microchip USA

USA . 2,612 parts In-Stock

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Overview

Unleash the power of Texas Instruments with the 74AUC1G240DBVRG4, a top-of-the-line Bus Driver & Transceiver that delivers unmatched quality and reliability. Perfect for a wide range of applications, this compact device offers lightning-fast propagation delay and low power consumption. With its inverted output polarity and 3-STATE characteristics, it provides exceptional performance while maintaining a small form factor. Trust Texas Instruments to bring you cutting-edge technology that meets your needs and exceeds your expectations. Upgrade to the 74AUC1G240DBVRG4 today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during installation and operation.

Propagation Delay At Nominal Supply: 3.3 ns

Low propagation delay ensures fast and efficient signal transmission, making this bus driver ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 1.2

Operating at a low supply voltage of 1.2V ensures energy efficiency and compatibility with low-power systems.

Output Characteristics: 3-STATE

The 3-STATE output allows the bus driver to control the bus lines, enabling high flexibility in connecting multiple devices to the same bus.

Technology: TTL

Utilizing TTL technology ensures compatibility with other TTL logic devices, making it a versatile choice for design engineers.

Technical Specifications

Bus Driver & Transceivers 74AUC1G240DBVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AUC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.3 ns

Propagation Delay (tpd):

3.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.6 mm

Trade Compliance

74AUC1G240DBVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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