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74ALVCH162836VRE4

Texas Instruments

74ALVCH162836VRE4 by Texas Instruments

The Texas Instruments 74ALVCH162836VRE4 is a 20-bit bus driver with a propagation delay of 4 ns at 1.8 V, suitable for industrial applications. It features a max I (ol) of 12 Amp and operates within a temperature range of -40 to 85 °C, making it ideal for high-performance systems requiring fast signal transmission. With surface mount capability and dual terminal position, this CMOS technology device offers efficient data transfer in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,539 parts In-Stock

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Vyrian

USA . 4,426 parts In-Stock

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4,426

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Distributors (Availability)

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Northwest PG Solutions

USA . 721 parts In-Stock

1+ parts

$2.455

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721

$2.455

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Andel Nordic

Denmark . 311 parts In-Stock

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$7.849

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-

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$7.535

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$7.535

311

$7.849

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$7.535

$7.535

Parana Technologies

USA . 526 parts In-Stock

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$10.909

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$11.379

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526

$10.909

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$11.379

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DigiPath Technology Company

USA . 2,143 parts In-Stock

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$12.012

100+ parts

$11.051

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2,143

$12.012

$11.051

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IDEA Electronic Components Group

UK . 494 parts In-Stock

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$12.257

100+ parts

$11.644

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$11.031

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494

$12.257

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$11.031

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ChromeModa Solutions

Germany . 32 parts In-Stock

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$12.257

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$10.051

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32

$12.257

$10.051

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AZTECH Wire

Italy . 667 parts In-Stock

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$17.932

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$17.932

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One Stop Electronics

USA . 1,099 parts In-Stock

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$27.000

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$27.000

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Corphita

USA . 653 parts In-Stock

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Native Components

USA . 438 parts In-Stock

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$2.165

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Microchip USA

USA . 391 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the Texas Instruments 74ALVCH162836VRE4 bus driver & transceiver. Crafted with precision and expertise by a renowned manufacturer, this cutting-edge device offers lightning-fast propagation delay, low power consumption, and versatile applications across various industries. Elevate your projects with the superior quality and reliability of Texas Instruments technology, ensuring optimal performance and efficiency every time. Experience the value and benefits of this top-of-the-line product, designed to meet your specific needs and exceed your expectations. Choose Texas Instruments for unparalleled quality and innovation in bus drivers and transceivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring longevity and ease of handling.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay at nominal supply voltage ensures efficient and fast data transmission.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage, making it energy-efficient and suitable for portable or battery-operated devices.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with series resistor provides flexibility in controlling output signals and helps in reducing signal reflections.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices and systems.

Technical Specifications

Bus Driver & Transceivers 74ALVCH162836VRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

11.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

20

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74ALVCH162836VRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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