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74AHC1G125DCKTE4

Texas Instruments

74AHC1G125DCKTE4 by Texas Instruments

74AHC1G125DCKTE4 by Texas Instruments is a CMOS bus driver with 3-STATE output, featuring a propagation delay of 13 ns at 3.3V supply voltage. With a max operating temperature of 125°C, it is ideal for automotive applications requiring fast signal transmission and low power consumption. The package style is small outline with dual terminals and nickel palladium gold finish, making it suitable for compact designs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,066 parts In-Stock

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Digiode

USA . 3,139 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 234 parts In-Stock

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$5.441

100+ parts

-

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$5.223

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$5.223

234

$5.441

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$5.223

$5.223

AZTECH Wire

Italy . 711 parts In-Stock

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$16.874

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Parana Technologies

USA . 1,407 parts In-Stock

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$20.512

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$20.578

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DigiPath Technology Company

USA . 2,072 parts In-Stock

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$22.586

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$20.779

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$22.586

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

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$23.047

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$21.895

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$20.742

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2,116

$23.047

$21.895

$20.742

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ChromeModa Solutions

Germany . 1,871 parts In-Stock

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$23.047

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$18.899

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One Stop Electronics

USA . 1,387 parts In-Stock

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$31.000

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Corphita

USA . 1,323 parts In-Stock

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Northwest PG Solutions

USA . 1,077 parts In-Stock

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Microchip USA

USA . 1,048 parts In-Stock

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Native Components

USA . 702 parts In-Stock

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Overview

Experience seamless signal transmission with the 74AHC1G125DCKTE4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers exceptional bus driver & transceivers that are perfect for a wide range of applications. From automotive to industrial settings, this product offers unmatched value with its fast propagation delay, low power consumption, and compact design. Trust Texas Instruments for all your signal transmission needs and elevate your projects to new heights with the 74AHC1G125DCKTE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceiver, ensuring a longer lifespan for the product.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage allows for compatibility with a wide range of electronic devices, making this bus driver and transceiver versatile and suitable for various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand extreme environmental conditions, making it reliable for use in automotive or industrial settings.

Output Characteristics: 3-STATE

The 3-STATE output allows for the bus driver and transceiver to drive bus lines to a high impedance state, which can prevent bus contention and improve system efficiency.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Technical Specifications

Bus Driver & Transceivers 74AHC1G125DCKTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AHC1G125DCKTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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