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74AC11257PWRE4

Texas Instruments

74AC11257PWRE4 by Texas Instruments

74AC11257PWRE4 by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It has a propagation delay of 10.1 ns at 5V, making it suitable for industrial applications requiring fast switching speeds. With a small outline package style and surface mount capability, it offers versatile integration options in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,285 parts In-Stock

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3,285

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Digiode

USA . 2,330 parts In-Stock

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2,330

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Distributors (Availability)

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Native Components

USA . 943 parts In-Stock

1+ parts

$6.075

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-

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943

$6.075

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AZTECH Wire

Italy . 410 parts In-Stock

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$17.159

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410

$17.159

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Parana Technologies

USA . 2,193 parts In-Stock

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$18.236

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$18.371

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2,193

$18.236

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$18.371

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DigiPath Technology Company

USA . 1,363 parts In-Stock

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$20.080

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$18.474

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1,363

$20.080

$18.474

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ChromeModa Solutions

Germany . 4,400 parts In-Stock

1+ parts

$20.490

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$16.802

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4,400

$20.490

$16.802

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IDEA Electronic Components Group

UK . 494 parts In-Stock

1+ parts

$20.490

100+ parts

$19.466

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$18.441

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494

$20.490

$19.466

$18.441

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One Stop Electronics

USA . 144 parts In-Stock

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$25.000

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$25.000

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Corphita

USA . 2,370 parts In-Stock

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Northwest PG Solutions

USA . 2,088 parts In-Stock

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$5.953

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Microchip USA

USA . 464 parts In-Stock

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Overview

Discover the superior performance and reliability of the 74AC11257PWRE4 by Texas Instruments, a top-of-the-line multiplexer & demultiplexer. With a renowned reputation for quality, Texas Instruments delivers a product that excels in applications requiring precision and efficiency. This versatile component offers customers unmatched value with its fast propagation delay, low power consumption, and compact design. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the 74AC11257PWRE4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 10.1 ns

This low propagation delay ensures fast signal processing within the multiplexer/demultiplexer.

Surface Mount: YES

Being surface mountable makes installation and integration easier and more convenient.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard supply voltage of 5V.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in controlling the output signal's state.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperatures, suitable for industrial environments.

Technical Specifications

Multiplexer & Demultiplexer 74AC11257PWRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

10.1 ns

Propagation Delay (tpd):

10.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

74AC11257PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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