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5962-01-382-4970

Texas Instruments

5962-01-382-4970 by Texas Instruments

Texas Instruments' 5962-01-382-4970 FPGA features 547 logic cells, CMOS technology, and 69 inputs/outputs. With a package style of chip carrier, it is ideal for commercial applications requiring a max operating temperature of 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,875 parts In-Stock

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Digiode

USA . 4,805 parts In-Stock

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4,805

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AZTECH Wire

Italy . 317 parts In-Stock

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$11.529

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317

$11.529

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One Stop Electronics

USA . 653 parts In-Stock

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$22.000

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Semicontronic

India . 1,113 parts In-Stock

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$26.000

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$25.350

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$25.220

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Parana Technologies

USA . 1,047 parts In-Stock

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$46.438

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DigiPath Technology Company

USA . 1,620 parts In-Stock

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$51.134

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$47.044

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$51.134

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ChromeModa Solutions

Germany . 6,051 parts In-Stock

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$52.178

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$42.786

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6,051

$52.178

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

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$52.178

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$49.569

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$46.960

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2,087

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RGB Technical Solutions

Ukraine . 6,446 parts In-Stock

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Corphita

USA . 4,229 parts In-Stock

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Northwest PG Solutions

USA . 2,031 parts In-Stock

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Native Components

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Overview

Experience the cutting-edge technology of Texas Instruments with the 5962-01-382-4970 Field Programmable Gate Array. This FPGA boasts 547 logic cells and 69 inputs and outputs, making it a versatile and powerful component for a variety of applications. With a nominal supply voltage of 5V and commercial-grade temperature grading, this FPGA offers reliable performance in any environment. Trust in Texas Instruments' reputation for high-quality products and unlock endless possibilities with the 5962-01-382-4970. Elevate your projects with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FPGA, making it a reliable choice for long-term use.

No. of Logic Cells: 547

With a higher number of logic cells, this FPGA can handle complex digital logic designs and processing tasks efficiently.

Surface Mount: YES

Surface mount technology makes it easy to integrate this FPGA onto circuit boards, saving space and simplifying the overall design.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient performance and reliable operation.

No. of Inputs: 69

The high number of inputs allows for versatile input connectivity and processing capabilities, making it suitable for a wide range of applications.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies power management.

No. of Outputs: 69

The FPGA's numerous outputs provide flexibility in routing signals and processing data, making it suitable for applications requiring multiple output channels.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5962-01-382-4970 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Logic Cells:

547

No. of Inputs:

69

No. of Outputs:

69

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies:

5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC84,1.2SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Pitch:

1.27 mm

No. of Terminals:

84

Standards

JESD-30 Code:

S-PQCC-J84

Qualified:

No

Trade Compliance

5962-01-382-4970 Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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