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5962-01-393-7814

Texas Instruments

5962-01-393-7814 by Texas Instruments

Texas Instruments' 5962-01-393-7814 FPGA features 547 logic cells, CMOS technology, and 69 inputs/outputs. Ideal for military applications with a temperature range of -55 to 125°C, this ceramic package offers high reliability in harsh environments.

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 6,486 parts In-Stock

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Digiode

USA . 2,146 parts In-Stock

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AZTECH Wire

Italy . 367 parts In-Stock

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$10.054

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One Stop Electronics

USA . 189 parts In-Stock

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Semicontronic

India . 177 parts In-Stock

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Native Components

USA . 526 parts In-Stock

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$73.635

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Northwest PG Solutions

USA . 179 parts In-Stock

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Parana Technologies

USA . 1,869 parts In-Stock

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DigiPath Technology Company

USA . 813 parts In-Stock

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ChromeModa Solutions

Germany . 5,859 parts In-Stock

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IDEA Electronic Components Group

UK . 62 parts In-Stock

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West Coast Incorporated

USA . 5,215 parts In-Stock

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Corphita

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Overview

Experience next-level performance with the 5962-01-393-7814 from Texas Instruments, a leader in high-quality Field Programmable Gate Arrays. This innovative FPGA boasts 547 logic cells and 69 inputs/outputs for seamless integration into your projects. With a ceramic package body and military-grade temperature grading, this versatile component ensures reliability in extreme conditions. Whether you're designing aerospace systems or industrial automation solutions, the 5962-01-393-7814 delivers unmatched value, flexibility, and performance that exceed expectations. Elevate your designs with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal conductivity and heat dissipation, making this FPGA suitable for high temperature environments.

No. of Logic Cells: 547

With 547 logic cells, this FPGA offers a good balance between complexity and performance for various applications.

Surface Mount: YES

Surface mount capability enables easy and efficient integration of the FPGA onto circuit boards, saving space and simplifying manufacturing processes.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the FPGA energy efficient and reliable.

No. of Inputs: 69

Having 69 inputs allows for versatile connectivity and interfacing options, enhancing the flexibility of the FPGA for different input requirements.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V makes this FPGA compatible with standard voltage levels and easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this FPGA can withstand high temperature environments, expanding its range of applications.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55°C ensures reliable performance in extreme cold conditions, making the FPGA suitable for a wider range of environments.

No. of Outputs: 69

Having 69 outputs enables the FPGA to drive multiple devices or components simultaneously, increasing its capability to handle complex tasks.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures the FPGA's reliability and performance in harsh conditions, making it suitable for defense and aerospace applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5962-01-393-7814 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Logic Cells:

547

No. of Inputs:

69

No. of Outputs:

69

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies:

5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Surface Mountable:

Yes

Package Style:

Flatpack

Package Code:

DFP

Package Shape:

Package Equivalence Code:

FL84(UNSPEC)

Terminal Characteristcs

Terminal Position:

Dual

Terminal Style:

No. of Terminals:

84

Standards

JESD-30 Code:

R-XDFP-F84

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

5962-01-393-7814 Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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