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5962-9096401MXX

Texas Instruments

5962-9096401MXX by Texas Instruments

Texas Instruments' 5962-9096401MXX FPGA features 295 logic cells, CMOS technology, and 57 inputs/outputs. With a package style of grid array and military-grade temperature grading, it is ideal for high-reliability applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,958 parts In-Stock

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Digiode

USA . 710 parts In-Stock

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710

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One Stop Electronics

USA . 356 parts In-Stock

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$7.000

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356

$7.000

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AZTECH Wire

Italy . 820 parts In-Stock

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$11.863

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Native Components

USA . 533 parts In-Stock

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$52.801

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$50.689

533

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Northwest PG Solutions

USA . 737 parts In-Stock

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$58.081

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Parana Technologies

USA . 1,293 parts In-Stock

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$163.169

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DigiPath Technology Company

USA . 742 parts In-Stock

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$179.669

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$165.296

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742

$179.669

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ChromeModa Solutions

Germany . 6,757 parts In-Stock

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$183.336

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$150.336

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IDEA Electronic Components Group

UK . 1,355 parts In-Stock

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$183.336

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$174.169

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$165.002

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Corphita

USA . 791 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the 5962-9096401MXX Field Programmable Gate Array. Perfect for a wide range of applications, this FPGA offers 295 logic cells, 57 inputs and outputs, and operates at temperatures ranging from -55 to 125°C. With a screening level of 38535Q/M;38534H;883B and a MILITARY-grade temperature grading, you can trust in the durability and longevity of this product. Upgrade your projects with ease using the 5962-9096401MXX, designed to exceed your expectations and deliver exceptional performance every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide better thermal conductivity and mechanical strength, making this FPGA suitable for environments with high temperature fluctuations.

No. of Logic Cells: 295

With 295 logic cells, this FPGA offers sufficient capacity for implementing medium-sized digital designs.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this FPGA energy efficient and reliable.

No. of Inputs: 57

Having 57 inputs allows for a wide range of input signals to be accommodated, increasing the versatility of this FPGA.

Nominal Supply Voltage (V): 5

Operating at a standard supply voltage of 5V makes integration with other components easier and enhances compatibility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables this FPGA to function reliably in harsh environmental conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5962-9096401MXX attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Logic Cells:

295

No. of Inputs:

57

No. of Outputs:

57

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies:

5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Surface Mountable:

No

Package Style:

Grid Array

Package Code:

PGA

Package Shape:

Package Equivalence Code:

PGA84M,11X11

Terminal Characteristcs

Terminal Position:

Perpendicular

Terminal Style:

Terminal Pitch:

2.54 mm

No. of Terminals:

84

Standards

JESD-30 Code:

S-XPGA-P84

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

5962-9096401MXX Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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