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Z0402DF1AA2

STMicroelectronics

Z0402DF1AA2 by STMicroelectronics

Z0402DF1AA2 by STMicroelectronics is a 4A TRIAC with 400V repetitive peak off-state voltage. It operates b/w -40 °C to 125°C, with a max DC gate trigger current of 3mA and voltage of 2V. Ideal for applications requiring precise AC power control in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,000

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Anansix

USA . 2,428 parts In-Stock

1+ parts

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1k+ parts

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2,428

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Vyrian

USA . 2,346 parts In-Stock

1+ parts

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2,346

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Digiode

USA . 271 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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271

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 902 parts In-Stock

1+ parts

$2.941

100+ parts

-

1k+ parts

$2.647

10k+ parts

-

902

$2.941

-

$2.647

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MKK Technologies

India . 404 parts In-Stock

1+ parts

$5.531

100+ parts

-

1k+ parts

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404

$5.531

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DigiPath Technology Company

USA . 404 parts In-Stock

1+ parts

$5.531

100+ parts

-

1k+ parts

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10k+ parts

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404

$5.531

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AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$8.440

100+ parts

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355

$8.440

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Corphita

USA . 4,889 parts In-Stock

1+ parts

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4,889

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Parana Technologies

USA . 1,896 parts In-Stock

1+ parts

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100+ parts

$3.517

1k+ parts

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1,896

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$3.517

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Overview

Upgrade your electronic devices with the Z0402DF1AA2 by STMicroelectronics, a top-quality TRIAC that offers unmatched performance and reliability. Manufactured by the reputable STMicroelectronics, this TRIAC is designed to meet the highest industry standards, making it perfect for a wide range of applications. Whether you're looking to enhance your lighting systems or control your home appliances more efficiently, this product provides exceptional value, benefits, and advantages to customers. Invest in the Z0402DF1AA2 today and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term use.

Maximum DC Gate Trigger Current: 3 mA

Low gate trigger current allows for efficient control and operation of the TRIAC.

Configuration: SINGLE

SINGLE configuration simplifies installation and makes it easy to integrate into various systems.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and placement in different applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and support stability during operation.

Maximum Leakage Current: 0.2 mA

Low leakage current helps in reducing power consumption and enhances energy efficiency.

No. of Terminals: 3

Having 3 terminals provides flexibility in connecting the TRIAC in circuits.

Package Style (Meter): IN-LINE

In-line package style makes it convenient for PCB layout and space-saving designs.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures stable performance in diverse environmental conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC offers precise control and compatibility with different systems.

Minimum Operating Temperature: -40 °C

Low operating temperature allows for reliable performance even in harsh cold environments.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides corrosion resistance and improves soldering reliability.

Terminal Position: SINGLE

Single terminal position simplifies installation and connections in circuits.

Maximum RMS On-state Current: 4 A

High on-state current rating enables the TRIAC to handle heavy loads efficiently.

Maximum DC Gate Trigger Voltage: 2 V

Low gate trigger voltage facilitates easy control and operation of the TRIAC.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage rating ensures safe and reliable operation in various applications.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/us

High rate of rise of off-state voltage helps in quick switching and response times.

Maximum Holding Current: 10 mA

Having a high holding current ensures stable operation and prevents false triggering.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0402DF1AA2 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

3 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0402DF1AA2 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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