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VNP10N07FI

STMicroelectronics

VNP10N07FI by STMicroelectronics

VNP10N07FI by STMicroelectronics is a MOS peripheral driver with built-in protections like over current and thermal. It has 3 terminals, open-drain output, and a peak current limit of 10A. Ideal for applications requiring buffer or inverter based interface ICs with sink output flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,731 parts In-Stock

1+ parts

-

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6,731

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Anansix

USA . 296 parts In-Stock

1+ parts

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-

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296

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Digiode

USA . 121 parts In-Stock

1+ parts

-

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121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 26 parts In-Stock

1+ parts

$8.288

100+ parts

-

1k+ parts

$7.459

10k+ parts

-

26

$8.288

-

$7.459

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MKK Technologies

India . 2,160 parts In-Stock

1+ parts

$15.586

100+ parts

-

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10k+ parts

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2,160

$15.586

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DigiPath Technology Company

USA . 2,160 parts In-Stock

1+ parts

$15.586

100+ parts

-

1k+ parts

-

10k+ parts

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2,160

$15.586

-

-

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$18.070

100+ parts

-

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789

$18.070

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-

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Microchip USA

USA . 372 parts In-Stock

1+ parts

$22.358

100+ parts

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372

$22.358

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Ampacity Inc.

Singapore . 1,353 parts In-Stock

1+ parts

$31.500

100+ parts

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1,353

$31.500

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Corphita

USA . 4,920 parts In-Stock

1+ parts

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4,920

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Parana Technologies

USA . 362 parts In-Stock

1+ parts

-

100+ parts

$9.910

1k+ parts

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362

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$9.910

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Overview

Enhance your electronic designs with the VNP10N07FI by STMicroelectronics. Crafted with precision and reliability in mind, this peripheral driver offers unmatched quality and performance. With built-in protections for over current, thermal, and zener clamp, this product ensures the safety of your devices. Ideal for a wide range of applications, including automotive and industrial systems, the VNP10N07FI delivers value and efficiency like no other. Trust STMicroelectronics to provide innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the internal components of the peripheral driver.

Built-in Protections: OVER CURRENT; THERMAL; ZENER CLAMP

The built-in protections ensure the safety and longevity of the peripheral driver by preventing damage from over current, thermal issues, and voltage spikes (Zener clamp).

Output Characteristics: OPEN-DRAIN

The open-drain output allows for easy interfacing with other components and devices, providing flexibility in circuit design.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals provides good conductivity and corrosion resistance, ensuring reliable connections.

Technology: MOS

The MOS technology used in the peripheral driver offers high efficiency and fast switching speeds, making it suitable for various applications.

Technical Specifications

Peripheral Drivers VNP10N07FI attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; ZENER CLAMP

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

3

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

10 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

6 us

Turn-on Time:

.9 us

Trade Compliance

VNP10N07FI Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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