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VNP10N06

STMicroelectronics

VNP10N06 by STMicroelectronics

STMicroelectronics VNP10N06 is a 3-terminal peripheral driver with built-in protections for transient, over current, over voltage, and thermal issues. It has a turn-on time of 2.3 us and nominal output peak current limit of 10 A. This buffer or inverter based driver is commonly used in applications requiring flange mount package style.

Median Price

$19.600

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Forefront Electronics and Design

USA . 4 parts In-Stock

1+ parts

$19.600

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4

$19.600

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Vyrian

USA . 5,293 parts In-Stock

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5,293

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Digiode

USA . 2,963 parts In-Stock

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2,963

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Anansix

USA . 2,222 parts In-Stock

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2,222

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R&J Components

USA . 935 parts In-Stock

1+ parts

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935

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ComSIT Distribution GmbH

Germany . 770 parts In-Stock

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770

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LittleDiode

UK . 13 parts In-Stock

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13

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,164 parts In-Stock

1+ parts

$12.557

100+ parts

-

1k+ parts

$11.301

10k+ parts

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2,164

$12.557

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$11.301

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Microchip USA

USA . 126 parts In-Stock

1+ parts

$18.238

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126

$18.238

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AZTECH Wire

Italy . 495 parts In-Stock

1+ parts

$21.240

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495

$21.240

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MKK Technologies

India . 305 parts In-Stock

1+ parts

$23.613

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305

$23.613

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DigiPath Technology Company

USA . 305 parts In-Stock

1+ parts

$23.613

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305

$23.613

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Component Stockers USA

USA . 219 parts In-Stock

1+ parts

$99.990

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219

$99.990

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Corphita

USA . 3,585 parts In-Stock

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3,585

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Parana Technologies

USA . 1,284 parts In-Stock

1+ parts

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$15.014

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1,284

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$15.014

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Overview

Unleash the power of innovation with the VNP10N06 by STMicroelectronics, a top-tier manufacturer known for its high-quality products. As a leading player in the peripheral drivers category, this device offers unparalleled value and benefits to customers. With built-in protections against transient events, overcurrent, overvoltage, and thermal issues, this product ensures reliability and peace of mind. Its fast turn-on and turn-off times make it ideal for a wide range of applications, providing exceptional performance and efficiency. Trust STMicroelectronics to deliver cutting-edge solutions for all your driving needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for internal components, ensuring durability and reliability.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Ensures the safety of connected devices by protecting against various types of electrical faults and overloads.

No. of Terminals: 3

Simple and easy to connect, making installation and setup hassle-free.

Turn-on Time: 2.3 us

Quick response time allows for efficient operation and rapid control of peripheral devices.

Nominal Output Peak Current Limit: 10 A

High current handling capability enables the driver to power demanding peripherals without issues.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile compatibility with different types of peripherals, offering flexibility in various applications.

Technical Specifications

Peripheral Drivers VNP10N06 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

3

Nominal Output Peak Current Limit:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

1.8 us

Turn-on Time:

2.3 us

Trade Compliance

VNP10N06 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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