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VNP14NV04

STMicroelectronics

VNP14NV04 by STMicroelectronics

VNP14NV04 by STMicroelectronics is a peripheral driver with built-in protections for transient, over current, and over voltage. It has 3 terminals, a turn-on time of 4.5 us, and nominal output peak current limit of 24 A. This rectangular package style device is ideal for applications requiring sink output current flow direction in automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Vyrian

USA . 6,988 parts In-Stock

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Digiode

USA . 3,705 parts In-Stock

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Anansix

USA . 2,584 parts In-Stock

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DF Sales Co.

USA . 150 parts In-Stock

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150

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DF Sales Co.

USA . 150 parts In-Stock

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150

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Executive Electronics, Inc.

USA . 50 parts In-Stock

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Halfin

Belgium . 30 parts In-Stock

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ComSIT Distribution GmbH

Germany . 30 parts In-Stock

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Cogito LLC

Ukraine . 8 parts In-Stock

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Microchip USA

USA . 432 parts In-Stock

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$5.309

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$5.309

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IDEA Electronic Components Group

UK . 1,314 parts In-Stock

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$11.908

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$10.718

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AZTECH Wire

Italy . 137 parts In-Stock

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$21.140

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MKK Technologies

India . 29 parts In-Stock

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$22.393

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DigiPath Technology Company

USA . 29 parts In-Stock

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Perfect Parts

USA . 17,888 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,806 parts In-Stock

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Corphita

USA . 2,925 parts In-Stock

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Parana Technologies

USA . 818 parts In-Stock

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$14.238

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Overview

Experience the unmatched quality and reliability of STMicroelectronics with the VNP14NV04 peripheral driver. Built-in protections for transient, over current, over voltage, and thermal ensure peace of mind while using this product. Ideal for a wide range of applications, this rectangular package offers 24A nominal output peak current limit with a quick turn-on time of 4.5 us. Trust in STMicroelectronics to deliver top-notch performance and value with the VNP14NV04.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to impact, ensuring a longer lifespan.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure safety and reliability by safeguarding against various potential risks such as overcurrent, overvoltage, and thermal issues.

No. of Terminals: 3

Having 3 terminals allows for easy and efficient connection in a variety of circuit configurations.

Terminal Finish: MATTE TIN

The matte tin finish provides good electrical conductivity and corrosion resistance, enhancing the overall performance of the product.

Turn-on Time: 4.5 us

The quick turn-on time of 4.5 us ensures rapid response and precise control in applications that require fast switching times.

Nominal Output Peak Current Limit: 24 A

With a high peak current limit of 24 A, this peripheral driver can handle heavy loads without compromising performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type provides versatile compatibility and integration with a wide range of systems and devices.

Turn-off Time: 25 us

The turn-off time of 25 us ensures efficient switching off, preventing any potential damage or malfunction in the circuit.

Output Current Flow Direction: SINK

The sink output current flow direction allows for easy control and regulation of current flow, ensuring stability and reliability in operation.

Technical Specifications

Peripheral Drivers VNP14NV04 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

3

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

24 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

25 us

Turn-on Time:

4.5 us

Trade Compliance

VNP14NV04 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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