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VND920P13TR

STMicroelectronics

VND920P13TR by STMicroelectronics

VND920P13TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V, built-in protections against overcurrent and thermal issues. It features a compact 28-terminal design and operates efficiently b/w 5.5V to 36V. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,844

-

-

-

-

Digiode

USA . 2,377 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,377

-

-

-

-

Vyrian

USA . 1,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,297

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,923 parts In-Stock

1+ parts

$3.776

100+ parts

-

1k+ parts

$3.398

10k+ parts

-

1,923

$3.776

-

$3.398

-

MKK Technologies

India . 968 parts In-Stock

1+ parts

$7.100

100+ parts

-

1k+ parts

-

10k+ parts

-

968

$7.100

-

-

-

DigiPath Technology Company

USA . 968 parts In-Stock

1+ parts

$7.100

100+ parts

-

1k+ parts

-

10k+ parts

-

968

$7.100

-

-

-

Parana Technologies

USA . 2,246 parts In-Stock

1+ parts

-

100+ parts

$4.514

1k+ parts

-

10k+ parts

-

2,246

-

$4.514

-

-

Corphita

USA . 429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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429

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Overview

Unlock unparalleled performance with the VND920P13TR from STMicroelectronics, a leader in innovative semiconductor solutions. This exceptional peripheral driver ensures robust protection against transient spikes, overcurrent, and thermal issues, making it perfect for demanding applications in automotive and industrial sectors. Experience enhanced reliability and efficiency, empowering your designs to excel while reducing downtime and maintenance costs. Elevate your projects with ST's commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures lightweight durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling easier integration into modern circuit boards and saving valuable space.

Maximum Supply Voltage: 36 V

With a maximum supply voltage of 36 V, this driver can handle a wide range of applications, offering flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on printed circuit boards, making it an effective choice for diverse layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Built-in protections increase reliability and safety, preventing damage under adverse conditions, thus increasing the longevity of your devices.

Power Supplies (V): 8/36

Support for power supplies ranging from 8 to 36 V allows compatibility with a broad range of existing systems and components.

No. of Terminals: 28

With 28 terminals, the product provides ample connectivity points for complex circuit designs, enhancing functionality.

Package Style (Meter): SMALL OUTLINE

The small outline design contributes to space efficiency in compact devices, facilitating modern design requirements.

Minimum Supply Voltage: 5.5 V

A minimum supply voltage requirement of 5.5 V expands its usability in low-voltage applications, ensuring versatile deployment.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, enhancing overall performance and longevity.

Terminal Position: DUAL

Dual terminal positioning simplifies layout designs and ensures better signal integrity in various circuit configurations.

Maximum Seated Height: 2.65 mm

The low maximum seated height facilitates compatibility with slim electronic designs, making it ideal for modern compact devices.

Width: 7.5 mm

At a width of 7.5 mm, the product maintains a smaller footprint, making it suitable for crowded circuit board spaces.

Length: 17.9 mm

Its length of 17.9 mm strikes a good balance between design flexibility and performance, suitable for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides excellent mechanical strength and supports automated assembly, making manufacturing easier.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V ensures optimal performance across numerous applications, striking a great balance between efficiency and effectiveness.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm helps in precise placement during assembly and strengthens interconnections between circuit elements.

Driver No. of Bits: 2

With a 2-bit driver capability, this product can efficiently handle simple control applications, making it versatile for different needs.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This specified interface type allows flexibility in design, able to serve various buffering and inverting tasks within systems.

Output Current Flow Direction: SOURCE

The source output current flow direction allows it to drive loads directly, simplifying circuit design and improving operational efficiency.

Technical Specifications

Peripheral Drivers VND920P13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VND920P13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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