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VND92013TR

STMicroelectronics

VND92013TR by STMicroelectronics

VND92013TR by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent and thermal issues. It features dual functions, operates b/w 5.5V to 36V, and supports up to 45A output current. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,449

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-

-

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Bristol Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Digiode

USA . 2,996 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,996

-

-

-

-

Anansix

USA . 1,209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,209

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-

-

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Q Components

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 465 parts In-Stock

1+ parts

$4.738

100+ parts

-

1k+ parts

-

10k+ parts

-

465

$4.738

-

-

-

IDEA Electronic Components Group

UK . 2,321 parts In-Stock

1+ parts

$10.034

100+ parts

-

1k+ parts

$9.030

10k+ parts

-

2,321

$10.034

-

$9.030

-

AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$14.300

100+ parts

-

1k+ parts

-

10k+ parts

-

455

$14.300

-

-

-

MKK Technologies

India . 184 parts In-Stock

1+ parts

$18.867

100+ parts

-

1k+ parts

-

10k+ parts

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184

$18.867

-

-

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DigiPath Technology Company

USA . 184 parts In-Stock

1+ parts

$18.867

100+ parts

-

1k+ parts

-

10k+ parts

-

184

$18.867

-

-

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Ampacity Inc.

Singapore . 733 parts In-Stock

1+ parts

$50.500

100+ parts

-

1k+ parts

-

10k+ parts

-

733

$50.500

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,000

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-

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Kepictronics

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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4,500

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-

-

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Corphita

USA . 4,067 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,067

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S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,000

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-

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Parana Technologies

USA . 2,077 parts In-Stock

1+ parts

-

100+ parts

$11.997

1k+ parts

-

10k+ parts

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2,077

-

$11.997

-

-

Overview

Unlock unparalleled performance with the VND92013TR by STMicroelectronics—a top-tier peripheral driver designed for reliability and efficiency. Known for its superior quality and robust protections against overcurrent, thermal issues, and voltage anomalies, this compact device is ideal for a range of applications from automotive to industrial automation. Enjoy seamless integration and peace of mind, knowing you’re backed by STMicroelectronics’ legacy of innovation and excellence. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy material ensures longevity and reliability in various operating environments.

Surface Mount: YES

Surface mount technology allows for efficient assembly and reduced space requirements on PCBs.

Maximum Supply Voltage: 36 V

A high maximum supply voltage makes this driver suitable for a wide range of applications, providing flexibility in design.

No. of Functions: 2

With two functions, this peripheral driver can perform multiple tasks, enhancing circuit efficiency.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier layout on PCBs, allowing for space-efficient designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections safeguard the device and the application from damaging conditions, ensuring reliability.

Power Supplies (V): 8/36

The ability to operate with a voltage range from 8V to 36V provides versatility for different applications.

No. of Terminals: 28

A higher number of terminals allows for more connections and functionalities, making it suitable for complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space on the PCB, ideal for compact and space-sensitive applications.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage enables compatibility with a wide variety of devices and power supplies.

Terminal Finish: NICKEL PALLADIUM GOLD

A high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing performance and durability.

Terminal Position: DUAL

Dual terminal positioning offers design flexibility, accommodating different layout preferences and requirements.

Maximum Seated Height: 2.65 mm

A compact height profile allows for easy integration into slim devices or systems where space is at a premium.

Width: 7.5 mm

The moderate width provides a balance between performance and footprint, fitting into various design constraints.

Maximum Time At Peak Reflow Temperature (s): 30

A controlled reflow time ensures reliable soldering without overheating, preserving component integrity.

Peak Reflow Temperature °C: 250

Operating at a peak reflow temperature of 250 °C means it can withstand standard soldering processes commonly used in assembly.

Length: 17.9 mm

A length of 17.9 mm strikes a good balance, enabling effective layout management while maximizing functionality.

Maximum Output Current: 0.005 A

While the output current is modest, it is suitable for many low-power applications, ensuring efficiency.

Terminal Form: GULL WING

Gull wing terminals allow for easy visual inspection and provide solid mechanical support upon soldering.

Nominal Supply Voltage: 13 V

The nominal operating voltage of 13V allows for optimized performance in typical applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is compatible with many PCB designs, ensuring ease of integration.

Driver No. of Bits: 2

Supporting a 2-bit configuration enables basic digital control, suitable for various simple applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, allowing for standard precautions during handling and assembly.

Nominal Output Peak Current Limit: 45 A

A peak output current limit of 45A provides significant drive capability, suitable for demanding peripheral applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being an interface IC type, it provides essential buffering or inversion capabilities, critical for signal integrity.

Output Current Flow Direction: SINK

The ability to sink current effectively manages signal transitions in applications, enhancing overall performance.

Technical Specifications

Peripheral Drivers VND92013TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

28

Output Current Flow Direction:

SINK

Maximum Output Current:

.005 A

Nominal Output Peak Current Limit:

45 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND92013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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