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VND920TR-E

STMicroelectronics

VND920TR-E by STMicroelectronics

VND920TR-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V, supporting dual functions. It features built-in protections against overcurrent and thermal issues, making it ideal for reliable applications. With a compact SO package and nickel-palladium-gold terminals, it's perfect for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,217

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-

-

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Digiode

USA . 2,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,613

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-

-

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Anansix

USA . 2,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,174

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$6.170

100+ parts

$5.615

1k+ parts

$5.059

10k+ parts

-

500

$6.170

$5.615

$5.059

-

Microchip USA

USA . 249 parts In-Stock

1+ parts

$6.709

100+ parts

-

1k+ parts

-

10k+ parts

-

249

$6.709

-

-

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IDEA Electronic Components Group

UK . 1,947 parts In-Stock

1+ parts

$7.468

100+ parts

-

1k+ parts

$6.721

10k+ parts

-

1,947

$7.468

-

$6.721

-

AZTECH Wire

Italy . 1,009 parts In-Stock

1+ parts

$12.240

100+ parts

-

1k+ parts

-

10k+ parts

-

1,009

$12.240

-

-

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MKK Technologies

India . 509 parts In-Stock

1+ parts

$14.042

100+ parts

-

1k+ parts

-

10k+ parts

-

509

$14.042

-

-

-

DigiPath Technology Company

USA . 509 parts In-Stock

1+ parts

$14.042

100+ parts

-

1k+ parts

-

10k+ parts

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509

$14.042

-

-

-

Corphita

USA . 1,750 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,750

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

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900

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Parana Technologies

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$8.929

1k+ parts

-

10k+ parts

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40

-

$8.929

-

-

Overview

Elevate your design with the VND920TR-E from STMicroelectronics, a leader in innovation and reliability. This versatile peripheral driver combines robust built-in protections against overcurrent and thermal issues with a sleek surface-mount package. Ideal for automotive and industrial applications, it offers exceptional performance and longevity, ensuring peace of mind and maximizing efficiency. Experience unparalleled quality that enhances your project’s capabilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this peripheral driver reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern PCB layouts, saving space in your project.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this product can handle a wide range of applications, ideal for both low and high voltage systems.

No. of Functions: 2

Having multiple functions increases versatility, allowing this driver to manage different tasks within the same module.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for placement on PCB and offers a standardized fit for various design needs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Built-in protections enhance safety and reliability, making this product suitable for demanding applications where failure is not an option.

Power Supplies (V): 8/36

The ability to operate within this voltage range allows for flexible usage in various circuit designs and applications.

No. of Terminals: 28

With 28 terminals, this peripheral driver provides ample connection points for interfacing with other components, enhancing its application potential.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact footprint, essential for space-constrained designs.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage makes this product compatible with standard logic levels, simplifying integration into mixed-voltage designs.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish offers exceptional corrosion resistance and reliable electrical contact, resulting in longer device life and performance.

Terminal Position: DUAL

Dual terminal positioning allows for easy interconnections, facilitating integration into different design architectures.

Maximum Seated Height: 2.65 mm

A low profile ensures compatibility with height-restricted applications, contributing to mechanical design flexibility.

Width: 7.5 mm

A compact width enhances PCB layout efficiency, making it easier to place other components closely together without interference.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time is ideal for ensuring optimal soldering quality without damaging the component, enhancing assembly reliability.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C accommodates a wide range of solder materials, promoting compatibility with diverse manufacturing processes.

Length: 17.9 mm

This length allows for efficient use of PCB space while providing sufficient area for mounting connections.

Maximum Output Current: 0.005 A

This output current specification enables the driver to handle light loads, making it suitable for signal interfacing and control applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of visibility for soldering, reducing assembly errors.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V positions this driver well for standard operational applications, ensuring stable performance.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is common and ensures compatibility with a wide range of PCB designs, simplifying the design process.

Driver No. of Bits: 2

With 2 bits, this driver is capable of handling basic digital signal processing, making it suitable for a variety of simple interfacing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable moisture sensitivity, prompting appropriate handling and storage guidelines for longevity and reliable performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This classification as a buffer or inverter-based driver ensures compatibility with various logic levels and simplifies design integration.

Output Current Flow Direction: SOURCE

The source current flow direction is advantageous for driving loads directly, easing integration into system designs without requiring additional components.

Technical Specifications

Peripheral Drivers VND920TR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND920TR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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