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VND920-E

STMicroelectronics

VND920-E by STMicroelectronics

VND920-E by STMicroelectronics is a dual-function peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact SO package (28 terminals) for efficient surface mounting. Ideal for automotive and industrial applications requiring reliable power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,399 parts In-Stock

1+ parts

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7,399

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Digiode

USA . 965 parts In-Stock

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965

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Anansix

USA . 192 parts In-Stock

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192

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 574 parts In-Stock

1+ parts

$9.500

100+ parts

-

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574

$9.500

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-

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IDEA Electronic Components Group

UK . 2,351 parts In-Stock

1+ parts

$13.346

100+ parts

-

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$12.012

10k+ parts

-

2,351

$13.346

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$12.012

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AZTECH Wire

Italy . 926 parts In-Stock

1+ parts

$13.710

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926

$13.710

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MKK Technologies

India . 1,473 parts In-Stock

1+ parts

$25.097

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1,473

$25.097

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DigiPath Technology Company

USA . 1,473 parts In-Stock

1+ parts

$25.097

100+ parts

-

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1,473

$25.097

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Component Stockers USA

USA . 647 parts In-Stock

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$99.990

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647

$99.990

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Microchip USA

USA . 5,216 parts In-Stock

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5,216

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Corphita

USA . 4,448 parts In-Stock

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4,448

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Parana Technologies

USA . 1,836 parts In-Stock

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$15.958

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1,836

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$15.958

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Kepictronics

USA . 99 parts In-Stock

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99

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Overview

Unlock the potential of your projects with the VND920-E from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile peripheral driver offers superior performance and built-in protections against transient spikes, overcurrent, and thermal issues, ensuring reliability in demanding applications. With its compact design and robust features, it seamlessly enhances your devices while delivering exceptional quality and value—experience the advantage that industry expertise brings!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface-mount technology allows for compact designs and efficient use of PCB space, ideal for modern electronics.

Maximum Supply Voltage: 36 V

High maximum supply voltage makes this peripheral driver versatile for different high-voltage applications.

No. of Functions: 2

Having multiple functions in a single chip can save space and cost in circuit design, enhancing efficiency.

Package Shape: RECTANGULAR

Rectangular package shape is standard for easy integration into PCB layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance the reliability and safety of the product, reducing the risk of failure.

Power Supplies (V): 8/36

Wide power supply range supports a variety of applications, making the driver adaptable to different systems.

No. of Terminals: 28

28 terminals allow for a complex design and flexibility in connecting multiple components or signals.

Package Style (Meter): SMALL OUTLINE

A small outline package style optimizes space on PCBs, making it a suitable choice for compact devices.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage allows for compatibility with a wide range of low-voltage applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish enhances conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible layout options in PCB design, facilitating easier routing.

Maximum Seated Height: 2.65 mm

Low profile design aids in fitting components into tighter spaces, crucial for miniaturized electronics.

Width: 7.5 mm

Compact width paired with other dimensions promotes space-saving designs in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows sufficient time during manufacturing processes for soldering, ensuring reliable and robust interconnections.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance ensures compatibility with standard soldering processes.

Length: 17.9 mm

A relatively short length provides flexibility in designing compact electronic systems.

Maximum Output Current: 0.005 A

Moderate output current capabilities suit various peripheral driving applications without overheating.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide strong mechanical and electrical connections.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V is common and allows for efficiency in many peripheral applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB layout and assembly processes, enhancing manufacturability.

Driver No. of Bits: 2

Having a 2-bit driver allows for the control of multiple signals in simple applications, optimizing functionality.

Moisture Sensitivity Level (MSL): 3

MSL 3 signifies moderate moisture sensitivity, making the product suitable for a variety of industrial environments with appropriate handling.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile buffer or inverter design enhances signal integrity and adaptability across different peripherals.

Output Current Flow Direction: SOURCE

Source output current flow direction enables compatibility with various circuit designs and simplifies integration.

Technical Specifications

Peripheral Drivers VND920-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND920-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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