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VND920

STMicroelectronics

VND920 by STMicroelectronics

VND920 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features dual functions in a compact SO package, ideal for automotive applications. With a nominal output peak current limit of 45A, it efficiently manages power in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,903 parts In-Stock

1+ parts

-

100+ parts

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5,903

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Digiode

USA . 4,133 parts In-Stock

1+ parts

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4,133

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Anansix

USA . 2,274 parts In-Stock

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2,274

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Q Components

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 385 parts In-Stock

1+ parts

$5.427

100+ parts

-

1k+ parts

-

10k+ parts

-

385

$5.427

-

-

-

IDEA Electronic Components Group

UK . 2,012 parts In-Stock

1+ parts

$7.686

100+ parts

-

1k+ parts

$6.917

10k+ parts

-

2,012

$7.686

-

$6.917

-

AZTECH Wire

Italy . 108 parts In-Stock

1+ parts

$11.430

100+ parts

-

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108

$11.430

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MKK Technologies

India . 599 parts In-Stock

1+ parts

$14.452

100+ parts

-

1k+ parts

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10k+ parts

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599

$14.452

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DigiPath Technology Company

USA . 599 parts In-Stock

1+ parts

$14.452

100+ parts

-

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10k+ parts

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599

$14.452

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Formix International (Excess)

India . 9,000 parts In-Stock

1+ parts

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9,000

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Corphita

USA . 4,152 parts In-Stock

1+ parts

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4,152

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Infinite Electronics LLP (Excess)

. 3,000 parts In-Stock

1+ parts

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3,000

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 750 parts In-Stock

1+ parts

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100+ parts

$9.189

1k+ parts

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10k+ parts

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750

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$9.189

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Overview

Elevate your designs with the VND920 by STMicroelectronics, a premium peripheral driver that seamlessly combines robust protection features with exceptional reliability. Crafted for performance, it excels in diverse applications—from automotive to industrial control—ensuring your projects operate safely and efficiently. Trust in STMicroelectronics’ commitment to quality; enjoy peace of mind and unleash innovation with the VND920’s dependable power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy body material ensures durability and reliability in various operating environments.

Surface Mount: YES

Surface mount technology enhances design flexibility and allows for compact circuit layouts.

Maximum Supply Voltage: 36 V

With a maximum supply voltage of 36V, this driver can be used in a wide range of applications requiring higher voltage operations.

No. of Functions: 2

Offering dual functions, this driver provides versatile capabilities that can simplify design and reduce component count.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space usage on PCBs, suitable for high-density applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections safeguard the device and connected components, enhancing reliability and longevity.

Power Supplies (V): 8/36

The versatile power supply range (8V to 36V) makes this product adaptable to various system designs.

No. of Terminals: 28

The 28 terminals offer ample connectivity options, facilitating a wide range of applications and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space and is ideal for compact electronic devices.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage ensures compatibility with various power sources, improving application flexibility.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent connectivity and resistance to corrosion, enhancing performance.

Terminal Position: DUAL

Dual terminal positioning allows for easier PCB layout and improved signal integrity.

Maximum Seated Height: 2.65 mm

With a low maximum seated height, this driver is suitable for space-constrained applications.

Width: 7.5 mm

The compact width of 7.5 mm contributes to a smaller overall footprint on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product can withstand standard soldering conditions without damage.

Peak Reflow Temperature °C: 250

The high peak reflow temperature support ensures compatibility with modern surface mount soldering processes.

Length: 17.9 mm

The compact length fits well in tight spaces, making it ideal for miniaturized devices.

Maximum Output Current: 0.005 A

A maximum output current of 5 mA is excellent for low-powered applications while still driving peripheral devices effectively.

Terminal Form: GULL WING

Gull wing terminals provide better solder joint integrity, essential for long-term reliability in circuit applications.

Nominal Supply Voltage: 13 V

Operating at a nominal supply voltage of 13V ensures optimal performance across various electronic designs.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch fits well in high-density applications, allowing for denser layouts without sacrificing performance.

Driver No. of Bits: 2

With a 2-bit driver architecture, this product offers simple and effective control for various peripheral devices.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates good handling and packaging characteristics, ensuring reliability during storage and assembly.

Nominal Output Peak Current Limit: 45 A

The capability to handle peak currents of up to 45 A allows this driver to support high-power applications efficiently.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter based peripheral driver, it enhances signal integrity and provides versatile interfacing options.

Output Current Flow Direction: SINK

The sink output current flow direction is advantageous in many applications, reducing the complexity of the design.

Technical Specifications

Peripheral Drivers VND920 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

28

Output Current Flow Direction:

SINK

Maximum Output Current:

.005 A

Nominal Output Peak Current Limit:

45 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND920 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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