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TSA1204IFT

STMicroelectronics

TSA1204IFT by STMicroelectronics

TSA1204IFT from STMicroelectronics is a 12-bit ADC with dual analog input channels, ideal for industrial applications. It operates at a sample rate of 20 MHz and supports a max input voltage of 2.8 V. Its compact flatpack design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,060 parts In-Stock

1+ parts

-

100+ parts

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8,060

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-

-

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Digiode

USA . 3,157 parts In-Stock

1+ parts

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3,157

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Cyclops Electronics Ltd

UK . 2,448 parts In-Stock

1+ parts

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2,448

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-

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Anansix

USA . 2,102 parts In-Stock

1+ parts

-

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2,102

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$11.084

100+ parts

$10.086

1k+ parts

$9.089

10k+ parts

-

10

$11.084

$10.086

$9.089

-

IDEA Electronic Components Group

UK . 1,304 parts In-Stock

1+ parts

$11.727

100+ parts

-

1k+ parts

$10.555

10k+ parts

-

1,304

$11.727

-

$10.555

-

AZTECH Wire

Italy . 65 parts In-Stock

1+ parts

$17.310

100+ parts

-

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-

10k+ parts

-

65

$17.310

-

-

-

MKK Technologies

India . 1,913 parts In-Stock

1+ parts

$22.052

100+ parts

-

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-

1,913

$22.052

-

-

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DigiPath Technology Company

USA . 1,913 parts In-Stock

1+ parts

$22.052

100+ parts

-

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-

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-

1,913

$22.052

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 10,301 parts In-Stock

1+ parts

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10,301

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Perfect Parts

USA . 7,455 parts In-Stock

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7,455

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Authorized Procurement Solutions

USA . 6,785 parts In-Stock

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6,785

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RC Electronics

USA . 5,769 parts In-Stock

1+ parts

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5,769

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A-Z Elektronik GmbH

Germany . 5,244 parts In-Stock

1+ parts

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5,244

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Microchip USA

USA . 5,152 parts In-Stock

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5,152

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

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2,500

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Metaverse IC Inc.

Canada . 2,448 parts In-Stock

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2,448

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Futuretech Components

Singapore . 2,400 parts In-Stock

1+ parts

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2,400

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-

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Parana Technologies

USA . 1,756 parts In-Stock

1+ parts

-

100+ parts

$14.022

1k+ parts

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1,756

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$14.022

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Corphita

USA . 625 parts In-Stock

1+ parts

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625

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Overview

Unlock unparalleled performance with the TSA1204IFT from STMicroelectronics, a leader in innovation. This high-quality analog-to-digital converter excels in applications ranging from industrial automation to precision instrumentation. Boasting exceptional accuracy and reliability, it ensures your projects achieve optimal results, even in extreme conditions. With its compact design and robust features, experience seamless integration and unmatched value, empowering your designs to reach their fullest potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the ADC can withstand various environmental conditions, suitable for industrial applications.

No. of Analog In Channels: 2

Having two channels allows for the simultaneous conversion of two different signals, enhancing functionality in multi-sensor applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic circuits.

Package Shape: SQUARE

A square package shape is efficient for PCB space optimization, making it easier to layout and reduce manufacturing complexities.

No. of Bits: 12

A 12-bit resolution provides a good balance between complexity and performance, offering high precision for most applications.

Maximum Linearity Error (EL): 0.0439 %

Low linearity error ensures accurate signal representation, making it suitable for high-fidelity and critical applications.

Power Supplies (V): 2.5

Operates at a low supply voltage, which helps in minimizing power consumption and can be used in battery-operated devices.

No. of Terminals: 48

A higher number of terminals provides more connectivity options, facilitating integration into complex systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design is beneficial for space-constrained applications while ensuring a robust connection.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial environments that may experience extreme operating conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperatures, increasing reliability in outdoor and harsh environmental applications.

Terminal Finish: TIN LEAD

The tin lead finish enhances solderability, ensuring robust electrical connections during assembly.

Terminal Position: QUAD

A quad terminal position allows for efficient space utilization and improves signal integrity.

Maximum Seated Height: 1.6 mm

The low profile allows for easier integration into compact electronic systems where height is a constraint.

Width: 7 mm

Compact width enables efficient PCB layout design and saves space for other components.

Length: 7 mm

The small length facilitates easy placement in space-limited applications, while retaining necessary features.

Temperature Grade: INDUSTRIAL

Industrial grade classification ensures reliability and performance in demanding environments.

Maximum Analog Input Voltage: 2.8 V

Capable of handling a significant range of input voltages, providing flexibility for various sensor types.

Sample Rate: 20 MHz

High sample rate allows for rapid acquisition of signals, making it suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high performance, ideal for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and better mechanical stability, enhancing durability.

Converter Type: ADC, PROPRIETARY METHOD

Utilizing a proprietary conversion method can offer specific performance benefits tailored to certain applications.

Nominal Supply Voltage: 2.5 V

Standard voltage supply simplifies power management in electronic designs.

Output Bit Code: BINARY

Binary output format is standard in digital systems, ensuring compatibility with various processing units.

Terminal Pitch: 0.5 mm

The fine pitch allows for compact PCB layouts, maximizing the use of space for more components.

Minimum Analog Input Voltage: 1.1 V

Covers a wide input voltage range, enabling connection with a variety of sensors and signal sources.

Output Format: PARALLEL, WORD

Parallel output can improve data transfer rates to microcontrollers or other digital systems.

Sample and Hold/Track and Hold: SAMPLE

The sampling capability allows for accurate capture of fluctuating signals, critical in dynamic measurement scenarios.

Technical Specifications

Analog-to-Digital Converters TSA1204IFT attributes and parameters. Explore more Analog-to-Digital Converters devices from STMicroelectronics

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0439 %

Sample Rate:

20 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

2.5 V

Minimum Analog Input Voltage:

1.1 V

Maximum Analog Input Voltage:

2.8 V

Nominal Supply Voltage:

2.5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

QFP48,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

TSA1204IFT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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