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TSA1002IFT

STMicroelectronics

TSA1002IFT by STMicroelectronics

TSA1002IFT by STMicroelectronics is a 10-bit ADC with a sample rate of 50 MHz, ideal for industrial applications. It operates b/w -40 °C to 85°C and requires a nominal voltage of 2.5 V. Its low-profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,602 parts In-Stock

1+ parts

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3,602

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Vyrian

USA . 2,902 parts In-Stock

1+ parts

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2,902

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Lakeland Logistics Inc

USA . 2,400 parts In-Stock

1+ parts

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2,400

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Bristol Electronics

USA . 2,400 parts In-Stock

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2,400

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Anansix

USA . 391 parts In-Stock

1+ parts

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391

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,660 parts In-Stock

1+ parts

$10.208

100+ parts

-

1k+ parts

$9.187

10k+ parts

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1,660

$10.208

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$9.187

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MKK Technologies

India . 1,153 parts In-Stock

1+ parts

$19.196

100+ parts

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1,153

$19.196

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DigiPath Technology Company

USA . 1,153 parts In-Stock

1+ parts

$19.196

100+ parts

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1,153

$19.196

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Corphita

USA . 3,155 parts In-Stock

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3,155

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 2,274 parts In-Stock

1+ parts

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100+ parts

$12.206

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2,274

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$12.206

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Assy Fe

Spain . 3 parts In-Stock

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3

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Overview

Elevate your projects with the TSA1002IFT from STMicroelectronics, a cutting-edge analog-to-digital converter designed for precision and reliability. Crafted from high-quality materials, this low-profile component ensures optimal performance in demanding environments—from industrial automation to medical devices. With its impressive sample rate and minimal linearity error, it delivers unparalleled accuracy and responsiveness, empowering your applications while maximizing efficiency and value. Trust STMicroelectronics for innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures robustness and reliability, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy integration into compact circuit designs, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape aids in efficient layout and optimization of circuit board space.

No. of Bits: 10

With 10 bits, this ADC provides a good balance between resolution and efficiency for mid-range applications.

Maximum Linearity Error (EL): 0.0781 %

A low maximum linearity error ensures high accuracy and precision in signal conversion, enhancing overall performance.

Power Supplies (V): 2.5

Operating at a low supply voltage of 2.5V makes this ADC energy-efficient and suitable for battery-operated devices.

No. of Terminals: 48

A larger number of terminals enables versatile connectivity options, accommodating various configurations and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile design allows for space-saving PCB layouts, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC is reliable in demanding environments and can handle industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures makes it suitable for use in extreme climates and harsh conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures reliable connections during assembly.

Terminal Position: QUAD

The quad terminal position offers flexibility in mounting, helping to optimize space and layout on PCBs.

Maximum Seated Height: 1.6 mm

A low maximum seated height facilitates compact designs, essential for modern electronics that require miniaturization.

Width: 7 mm

The 7 mm width fits well in a variety of layouts, contributing to efficient space management on circuit boards.

Length: 7 mm

Similar to width, the compact length allows for versatility and ease of integration into various electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial use, it ensures durability and reliability in harsh operational environments.

Maximum Analog Input Voltage: 1.1 V

Handles modest input voltage levels, making it suitable for low-voltage applications commonly found in modern electronic systems.

Sample Rate: 50 MHz

A high sample rate of 50 MHz allows for rapid data acquisition, making it ideal for high-speed applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, enhancing efficiency.

Terminal Form: GULL WING

The gull wing form allows for easy surface mounting and provides mechanical stability in assembly.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary conversion method might offer unique advantages in performance and specificity for niche applications.

Nominal Supply Voltage: 2.5 V

Low nominal supply voltage of 2.5V is conducive for power-sensitive applications, improving battery life in portable devices.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

Supports standard output formats, enhancing compatibility with various digital systems and simplifying integration.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density mounting, making it ideal for complex circuit designs.

Minimum Analog Input Voltage: 0.2 V

A low minimum analog input voltage supports a wide range of applications, accommodating weak signal conditions.

Output Format: PARALLEL, WORD

Parallel output format enables high-speed data transmission, ideal for applications requiring quick processing.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold functionality ensures accurate representation of signals, improving data fidelity in conversions.

Technical Specifications

Analog-to-Digital Converters TSA1002IFT attributes and parameters. Explore more Analog-to-Digital Converters devices from STMicroelectronics

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0781 %

Sample Rate:

50 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

2.5 V

Minimum Analog Input Voltage:

200 mV

Maximum Analog Input Voltage:

1.1 V

Nominal Supply Voltage:

2.5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

QFP48,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

TSA1002IFT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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