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TSA1203IF

STMicroelectronics

TSA1203IF by STMicroelectronics

TSA1203IF by STMicroelectronics is a 12-bit ADC with dual analog input channels, ideal for industrial applications. It operates at a sample rate of 40 MHz and supports a voltage range of 1.1V to 2.8V. Its compact flatpack design ensures efficient integration in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,757 parts In-Stock

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6,757

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Digiode

USA . 3,446 parts In-Stock

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3,446

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Anansix

USA . 1,686 parts In-Stock

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1,686

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Inventory MP

USA . 25 parts In-Stock

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25

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Bristol Electronics

USA . 25 parts In-Stock

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25

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NexGen Digital

USA . 15 parts In-Stock

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15

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Prism Electronics

USA . 4 parts In-Stock

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IDEA Electronic Components Group

UK . 2,080 parts In-Stock

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$14.423

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-

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$12.981

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2,080

$14.423

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$12.981

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AZTECH Wire

Italy . 712 parts In-Stock

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$17.070

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712

$17.070

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MKK Technologies

India . 203 parts In-Stock

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$27.121

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203

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DigiPath Technology Company

USA . 203 parts In-Stock

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$27.121

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203

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 3,537 parts In-Stock

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Vigor

Singapore . 3,523 parts In-Stock

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3,523

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Parana Technologies

USA . 1,059 parts In-Stock

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$17.245

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Perfect Parts

USA . 160 parts In-Stock

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Overview

Unlock unparalleled precision with the TSA1203IF from STMicroelectronics, a leader in innovation and quality. This robust 12-bit analog-to-digital converter excels in diverse industrial applications, delivering exceptional performance even in extreme conditions. With its low profile design and high-speed sampling, it ensures accuracy and reliability, empowering your projects with cutting-edge technology. Trust STMicroelectronics for products that elevate your designs and drive success!

Feature Benefit Bullets

No. of Analog In Channels: 2

Having two analog input channels allows for more versatility and capability in interfacing with multiple sensors or signals simultaneously.

Surface Mount: YES

The surface mount design facilitates compact placement on PCBs, ideal for space-constrained applications.

Package Shape: SQUARE

The square package shape helps in maintaining a uniform footprint, simplifying PCB layout and design.

No. of Bits: 12

With a 12-bit resolution, this ADC offers high precision, making it suitable for applications requiring detailed signal analysis.

Maximum Linearity Error (EL): 0.0244 %

A low maximum linearity error ensures that the output closely matches the input signal, enhancing measurement accuracy.

Power Supplies (V): 2.5

Operating at a nominal supply voltage of 2.5 V is cost-effective and compatible with common digital circuits.

No. of Terminals: 48

Having 48 terminals allows for extensive connectivity options, accommodating various interfacing needs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style optimizes space and promotes heat dissipation, making it suitable for advanced electronic systems.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, this ADC is reliable for use in industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can withstand extreme conditions, adding to its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent solderability and long-term reliability of electrical connections.

Terminal Position: QUAD

Quad terminal positioning aids in the efficient arrangement of connections on the PCB, improving routing.

Maximum Seated Height: 1.6 mm

With a maximum seated height of just 1.6 mm, this device is suitable for low-profile applications.

Width: 7 mm

A compact width of 7 mm allows for denser PCB layouts, making it ideal for miniaturized electronics.

Maximum Time At Peak Reflow Temperature (s): 40

Limiting the maximum time at peak reflow temperature to 40 seconds ensures that the components are not damaged during soldering.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260 °C, ensures compatibility with standard soldering practices.

Length: 7 mm

A length of 7 mm corresponds with its width, maintaining a square shape that enhances PCB design.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, making it reliable for demanding environments.

Maximum Analog Input Voltage: 2.8 V

Supports a maximum analog input voltage of 2.8 V, allowing compatibility with a range of sensor outputs.

Sample Rate: 40 MHz

A high sample rate of 40 MHz enables the ADC to capture high-frequency signals, suitable for dynamic applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high efficiency in the ADC's operation.

Terminal Form: GULL WING

The gull wing terminal form aids in easier manual and machine soldering processes.

Converter Type: ADC, PROPRIETARY METHOD

Utilizes a proprietary method that may provide enhanced performance characteristics compared to standard ADC types.

Nominal Supply Voltage: 2.5 V

This nominal supply voltage contributes to lower power consumption and better thermal performance.

Output Bit Code: BINARY

The binary output format simplifies interfacing with digital systems, making data processing easier.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a tighter, more compact layout on the PCB, optimizing space utilization.

Minimum Analog Input Voltage: 1.1 V

Enabling operation with a minimum analog input voltage of 1.1 V provides flexibility in interfacing with various sensors.

Output Format: PARALLEL, WORD

The parallel word output format facilitates faster data transfer rates to connected devices, enhancing overall system performance.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature improves the accuracy of readings, making it suitable for dynamic signal applications.

Moisture Sensitivity Level (MSL): 3

Rated at moisture sensitivity level 3, it provides adequate protection against moisture-related failures during production and storage.

Technical Specifications

Analog-to-Digital Converters TSA1203IF attributes and parameters. Explore more Analog-to-Digital Converters devices from STMicroelectronics

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

40 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

2.5 V

Minimum Analog Input Voltage:

1.1 V

Maximum Analog Input Voltage:

2.8 V

Nominal Supply Voltage:

2.5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

40 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

QFP48,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-XQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TSA1203IF Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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