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TSA1001CF

STMicroelectronics

TSA1001CF by STMicroelectronics

TSA1001CF from STMicroelectronics is a 10-bit ADC with a sample rate of 25 MHz, ideal for high-speed data acquisition. It operates on a nominal voltage of 2.5 V and features low linearity error at 0.0781%. This compact, surface-mount device suits various commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,487 parts In-Stock

1+ parts

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4,487

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Vyrian

USA . 3,020 parts In-Stock

1+ parts

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3,020

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Anansix

USA . 1,704 parts In-Stock

1+ parts

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1,704

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 864 parts In-Stock

1+ parts

$17.025

100+ parts

-

1k+ parts

$15.322

10k+ parts

-

864

$17.025

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$15.322

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MKK Technologies

India . 1,766 parts In-Stock

1+ parts

$32.014

100+ parts

-

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1,766

$32.014

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DigiPath Technology Company

USA . 1,766 parts In-Stock

1+ parts

$32.014

100+ parts

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1,766

$32.014

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Parana Technologies

USA . 2,228 parts In-Stock

1+ parts

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100+ parts

$20.356

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2,228

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$20.356

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Corphita

USA . 2,070 parts In-Stock

1+ parts

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2,070

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Kepictronics

USA . 84 parts In-Stock

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84

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Overview

Unlock unparalleled precision in your projects with the TSA1001CF from STMicroelectronics. Renowned for quality and innovation, STMicro delivers this compact 10-bit Analog-to-Digital Converter, designed to enhance performance across a multitude of applications, from industrial automation to consumer electronics. With its low power consumption and impressive sampling rate, you can trust the TSA1001CF to elevate your designs, ensuring accuracy and reliability every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product is resilient and suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic devices.

Package Shape: SQUARE

A square package shape aids in efficient placement and thermal management within circuit boards.

No. of Bits: 10

With 10 bits of resolution, this ADC provides a good balance between resolution and processing speed for many applications.

Maximum Linearity Error (EL): 0.0781 %

A low maximum linearity error indicates high accuracy and performance in converting analog signals to digital.

Power Supplies (V): 2.5 V

Designed to operate at a low voltage of 2.5 V, it helps in conserving power and reducing heat generation.

No. of Terminals: 48

With 48 terminals, this ADC offers ample connectivity options for a variety of applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design is ideal for space-constrained applications, facilitating better circuit board layout.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in moderate to warm environments.

Minimum Operating Temperature: 0 °C

The device can function down to 0 °C, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and reliability in connections.

Terminal Position: QUAD

Quad terminal position allows for easier PCB layout and design flexibility.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm enables compact designs and installations within slim electronic devices.

Width: 7 mm

With a manageable width of 7 mm, it fits well in many space-limited applications.

Length: 7 mm

A length of 7 mm contributes to maintaining a compact and efficient design.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this device is suitable for general-purpose use in various industries.

Maximum Analog Input Voltage: 1.1 V

Supports a maximum analog input voltage of 1.1 V, suitable for low-voltage applications.

Sample Rate: 25 MHz

A high sample rate of 25 MHz allows for fast data acquisition, essential for high-speed applications.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency and enables integration with other circuits.

Terminal Form: GULL WING

The gull wing form factor ensures reliable mechanical connections and is easy to handle during assembly.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC method offers unique features or performance benefits, differentiating it from standard models.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5 V ensures compatibility with low-power applications.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

Using binary and 2's complement output formats facilitates ease of integration with digital systems.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a compact design and efficient use of PCB space.

Minimum Analog Input Voltage: 0.2 V

It can handle a minimum input voltage of 0.2 V, making it versatile for low-level signals.

Output Format: PARALLEL, WORD

The parallel output format enables fast data transfer, which is crucial for real-time applications.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature improves measurement accuracy in dynamic signal applications.

Technical Specifications

Analog-to-Digital Converters TSA1001CF attributes and parameters. Explore more Analog-to-Digital Converters devices from STMicroelectronics

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0781 %

Sample Rate:

25 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

2.5 V

Minimum Analog Input Voltage:

200 mV

Maximum Analog Input Voltage:

1.1 V

Nominal Supply Voltage:

2.5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

QFP48,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

TSA1001CF Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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