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TSA1001IFT

STMicroelectronics

TSA1001IFT by STMicroelectronics

TSA1001IFT from STMicroelectronics is a 10-bit ADC with a sample rate of 25 MHz, ideal for industrial applications. It operates b/w -40 °C to 85°C and requires a nominal voltage of 2.5 V. Its compact flatpack design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,678 parts In-Stock

1+ parts

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4,678

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Digiode

USA . 1,237 parts In-Stock

1+ parts

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1,237

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Anansix

USA . 557 parts In-Stock

1+ parts

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557

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 144 parts In-Stock

1+ parts

$24.805

100+ parts

-

1k+ parts

$22.325

10k+ parts

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144

$24.805

-

$22.325

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MKK Technologies

India . 618 parts In-Stock

1+ parts

$46.644

100+ parts

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618

$46.644

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DigiPath Technology Company

USA . 618 parts In-Stock

1+ parts

$46.644

100+ parts

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618

$46.644

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Corphita

USA . 3,180 parts In-Stock

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3,180

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Parana Technologies

USA . 1,287 parts In-Stock

1+ parts

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$29.658

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1,287

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$29.658

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Overview

Unlock unparalleled precision with the TSA1001IFT from STMicroelectronics, a leader in innovative semiconductor solutions. This 10-bit analog-to-digital converter guarantees exceptional performance and reliability across diverse industrial applications. Designed for seamless integration, its low-profile packaging and robust temperature range ensure optimal operation even in demanding environments. Experience superior linearity and fast sampling rates that elevate your designs while benefiting from STMicroelectronics' commitment to quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protects the internal components from environmental factors, making it reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for a smaller circuit board footprint and easier integration into modern electronic devices.

Package Shape: SQUARE

The square shape optimizes space on printed circuit boards, allowing for a compact design.

No. of Bits: 10

A 10-bit resolution strikes a balance between performance and power consumption, suitable for a wide range of applications.

Maximum Linearity Error (EL): 0.0781%

A low maximum linearity error indicates high accuracy, making it a preferable choice for precision applications.

Power Supplies (V): 2.5

The nominal supply voltage of 2.5V ensures compatibility with low-power systems, contributing to energy efficiency.

No. of Terminals: 48

With 48 terminals, this ADC provides extensive connectivity options, which can accommodate complex systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This packaging style facilitates easy placement in densely packed designs, crucial for modern electronic products.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes this product suitable for industrial applications where thermal conditions can vary considerably.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables operation in extreme environments, useful for outdoor and rugged applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and reliability, ensuring stable connections in various conditions.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout and routing on PCB, enhancing design flexibility.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for space-constrained designs, contributing to thinner and more compact devices.

Width: 7 mm

The 7 mm width further aids compactness and makes it versatile for various applications, from consumer to industrial.

Length: 7 mm

A uniform length of 7 mm helps maintain a consistent footprint in designs, allowing for predictable layout requirements.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliable performance in harsh environments, essential for mission-critical applications.

Maximum Analog Input Voltage: 1.1 V

The maximum analog input voltage is suitable for low-voltage signal processing, ensuring compatibility with a range of analog sensors.

Sample Rate: 25 MHz

A sample rate of 25 MHz enables fast data acquisition, making it ideal for dynamic systems where rapid responses are required.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the ADC power-efficient and ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and assembly, ensuring robust connections and reliability.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary conversion method potentially offers unique performance advantages, providing distinct benefits over standard ADCs.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5V enhances the versatility of the ADC across various applications, particularly in low-power environments.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

This output coding ensures compatibility with various digital systems, making data integration straightforward.

Terminal Pitch: 0.5 mm

A tight 0.5 mm terminal pitch allows for higher component density on PCBs, critical for advanced electronics.

Minimum Analog Input Voltage: 0.2 V

The low minimum analog input voltage capability enables the processing of small signals, useful in precision measurement applications.

Output Format: PARALLEL, WORD

Parallel output format allows for high-speed data transfer, beneficial in applications requiring rapid data access.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature provides stability in signal acquisition, which is crucial for accurate digital representation.

Technical Specifications

Analog-to-Digital Converters TSA1001IFT attributes and parameters. Explore more Analog-to-Digital Converters devices from STMicroelectronics

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0781 %

Sample Rate:

25 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

2.5 V

Minimum Analog Input Voltage:

200 mV

Maximum Analog Input Voltage:

1.1 V

Nominal Supply Voltage:

2.5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

QFP48,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

TSA1001IFT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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