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TSA1041IF

STMicroelectronics

TSA1041IF by STMicroelectronics

TSA1041IF by STMicroelectronics is a 10-bit ADC with 4 analog input channels, ideal for industrial applications. It operates at a nominal supply of 2.5V and supports a sample rate of 50 MHz. Its compact low-profile package ensures efficient integration in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,063 parts In-Stock

1+ parts

-

100+ parts

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4,063

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Anansix

USA . 2,564 parts In-Stock

1+ parts

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1k+ parts

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2,564

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Digiode

USA . 558 parts In-Stock

1+ parts

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100+ parts

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558

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 796 parts In-Stock

1+ parts

$23.829

100+ parts

-

1k+ parts

$21.446

10k+ parts

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796

$23.829

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$21.446

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MKK Technologies

India . 1,084 parts In-Stock

1+ parts

$44.809

100+ parts

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10k+ parts

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1,084

$44.809

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DigiPath Technology Company

USA . 1,084 parts In-Stock

1+ parts

$44.809

100+ parts

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1,084

$44.809

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Parana Technologies

USA . 1,830 parts In-Stock

1+ parts

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100+ parts

$28.491

1k+ parts

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1,830

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$28.491

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Corphita

USA . 1,586 parts In-Stock

1+ parts

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1,586

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Overview

Unlock the power of precision with STMicroelectronics' TSA1041IF, a top-tier analog-to-digital converter designed for industrial applications. Renowned for its quality and reliability, STMicroelectronics delivers an ADC that boasts 10-bit resolution across four channels, ensuring exceptional performance even in demanding environments. Experience seamless integration, lower power consumption, and robust temperature resilience, empowering your projects with unmatched efficiency and accuracy. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making this ADC suitable for industrial applications.

No. of Analog In Channels: 4

Having four analog input channels allows for versatile data acquisition from multiple sources simultaneously, enhancing functionality.

Surface Mount: YES

Surface mount technology enables compact PCB designs, making this ADC ideal for space-constrained applications.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution and supports easier mounting on circuit boards.

No. of Bits: 10

A 10-bit resolution offers a good balance of accuracy and processing speed, catering well to a variety of signal processing needs.

Power Supplies (V): 2.5

Operating at 2.5V means lower power consumption, making this ADC energy efficient and suitable for battery-powered projects.

No. of Terminals: 48

A higher number of terminals facilitates greater connectivity options, allowing for more complex circuit integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is ideal for high-density board designs and helps maintain a low height profile, optimizing space and airflow.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this ADC is suitable for high-temperature applications in industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this ADC suitable for harsh environments, perfect for outdoor or extreme temperature applications.

Terminal Position: QUAD

Quad terminal positioning ensures better signal integrity and easier routing of traces on PCBs, improving performance.

Maximum Seated Height: 1.6 mm

The low seated height aids in compact designs and flexibility in layout, allowing for better overall system integration.

Width: 7 mm

A compact width supports space-efficient design, perfect for applications where space is at a premium.

Length: 7 mm

Similar to its width, the 7 mm length contributes to a compact footprint, making it suitable for portable devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in rigorous applications, extending the product's lifecycle.

Maximum Analog Input Voltage: 2 V

A maximum analog input voltage of 2V allows for the processing of low-level analog signals, increasing its usability in various applications.

Sample Rate: 50 MHz

A high sample rate of 50 MHz supports fast signal processing, making this ADC suitable for high-performance applications.

Technology: CMOS

CMOS technology enables low power consumption and high integration capability, making this ADC efficient and compact.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and are easy to handle during PCB assembly, improving overall production efficiency.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary conversion method may offer unique advantages in specific applications, enhancing performance characteristics compared to standard ADCs.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V ensures efficient power usage and compatibility with modern low-voltage circuits.

Output Bit Code: BINARY

Binary output code is universally recognized, making integration with digital systems straightforward and reliable.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for denser packing on PCBs, which is beneficial for high-performance and size-sensitive applications.

Output Format: PARALLEL, WORD

Parallel word output format facilitates faster data transfer rates to the processor, improving overall system efficiency.

Technical Specifications

Analog-to-Digital Converters TSA1041IF attributes and parameters. Explore more Analog-to-Digital Converters devices from STMicroelectronics

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Sample Rate:

50 MHz

Electrical Specifications

Power Supplies:

2.5 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

2.5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

QFP48,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

Trade Compliance

TSA1041IF Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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