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TSA1002CFT

STMicroelectronics

TSA1002CFT by STMicroelectronics

TSA1002CFT from STMicroelectronics is a 10-bit ADC with a sample rate of 50 MHz, ideal for high-speed data acquisition. It operates on a nominal voltage of 2.5 V and features low linearity error at 0.0781%. This compact, surface-mount device suits various commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,539 parts In-Stock

1+ parts

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2,539

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Digiode

USA . 1,717 parts In-Stock

1+ parts

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1,717

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Vyrian

USA . 1,406 parts In-Stock

1+ parts

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1,406

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 955 parts In-Stock

1+ parts

$5.942

100+ parts

-

1k+ parts

$5.348

10k+ parts

-

955

$5.942

-

$5.348

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MKK Technologies

India . 123 parts In-Stock

1+ parts

$11.174

100+ parts

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123

$11.174

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DigiPath Technology Company

USA . 123 parts In-Stock

1+ parts

$11.174

100+ parts

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123

$11.174

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Corphita

USA . 4,496 parts In-Stock

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4,496

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Parana Technologies

USA . 574 parts In-Stock

1+ parts

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100+ parts

$7.105

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574

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$7.105

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Overview

Elevate your projects with the TSA1002CFT from STMicroelectronics, a trusted leader in innovative solutions. This high-performance analog-to-digital converter ensures precision and reliability for various applications, from industrial automation to consumer electronics. Its compact design and low power requirements make it perfect for space-constrained environments, while its exceptional linearity guarantees accurate data capture. Unlock superior performance and drive your success with ST's commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides excellent protection for the internal components, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of integration into modern circuit boards.

Package Shape: SQUARE

The square shape enhances layout flexibility on the PCB, optimizing space utilization.

No. of Bits: 10

A 10-bit resolution offers a balance between performance and cost, suitable for many low to moderate precision applications.

Maximum Linearity Error (EL): 0.0781 %

Low linearity error ensures accurate signal conversion, making the ADC reliable for precise measurements.

Power Supplies (V): 2.5

Operates on a standard low voltage supply, reducing power consumption and enabling easier integration with other components.

No. of Terminals: 48

More terminals facilitate multiple connections, allowing for complex interfacing and increased functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Designed for low-profile applications, this packaging style saves space and provides compatibility with high-density layouts.

Maximum Operating Temperature: 70 °C

The product can operate in moderately high temperatures, making it suitable for commercial applications.

Minimum Operating Temperature: 0 °C

Can operate from freezing temperatures, ensuring reliability in varied environmental conditions.

Terminal Finish: TIN LEAD

Tin-lead finish promotes good solderability, increasing assembly reliability.

Terminal Position: QUAD

Quad terminal positioning enhances ease of layout and design on the PCB, providing flexibility for engineers.

Maximum Seated Height: 1.6 mm

Low profile height allows for compact device designs, enabling integration in space-constrained applications.

Width: 7 mm

Compact width is ideal for space-constrained designs, making it versatile for various applications.

Length: 7 mm

Similar to the width, this length ensures a compact overall footprint, useful in dense PCB layouts.

Temperature Grade: COMMERCIAL

Rated for commercial temperatures ensures adequate performance for standard consumer electronics.

Maximum Analog Input Voltage: 1.1 V

The ability to handle up to 1.1 V allows for use in a variety of applications without the risk of overloading.

Sample Rate: 50 MHz

High sample rate supports high-speed signal processing applications such as audio and video data conversion.

Technology: CMOS

CMOS technology is known for low power consumption and high density, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate simple and reliable PCB mounting, enhancing assembly efficiency.

Converter Type: ADC, PROPRIETARY METHOD

Proprietary methods may offer unique performance enhancements or features not seen in standard ADCs.

Nominal Supply Voltage: 2.5 V

Standard nominal supply voltage allows for compatibility with a wide range of power supplies.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

The output format provides compatibility with common processing systems, simplifying integration into digital circuits.

Terminal Pitch: 0.5 mm

Fine pitch allows for more terminals in a compact area, which is advantageous for dense circuit designs.

Minimum Analog Input Voltage: 0.2 V

Can handle low voltage signals, making it versatile for various types of input sources.

Output Format: PARALLEL, WORD

Parallel output format allows for high-speed data transfer, advantageous in real-time applications.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature improves signal fidelity during conversion, ensuring more accurate results.

Technical Specifications

Analog-to-Digital Converters TSA1002CFT attributes and parameters. Explore more Analog-to-Digital Converters devices from STMicroelectronics

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0781 %

Sample Rate:

50 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

2.5 V

Minimum Analog Input Voltage:

200 mV

Maximum Analog Input Voltage:

1.1 V

Nominal Supply Voltage:

2.5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

QFP48,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

TSA1002CFT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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