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TSA1002CF

STMicroelectronics

TSA1002CF by STMicroelectronics

TSA1002CF from STMicroelectronics is a 10-bit ADC with a sample rate of 50 MHz, ideal for high-speed data acquisition. It operates on a nominal voltage of 2.5 V and features low linearity error at 0.0781%. This compact, surface-mount device suits various commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,879 parts In-Stock

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1,879

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Anansix

USA . 211 parts In-Stock

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211

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Vyrian

USA . 72 parts In-Stock

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72

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 788 parts In-Stock

1+ parts

$9.494

100+ parts

-

1k+ parts

$8.545

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788

$9.494

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$8.545

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MKK Technologies

India . 915 parts In-Stock

1+ parts

$17.854

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915

$17.854

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DigiPath Technology Company

USA . 915 parts In-Stock

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$17.854

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915

$17.854

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Corphita

USA . 1,661 parts In-Stock

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1,661

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Parana Technologies

USA . 725 parts In-Stock

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$11.352

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725

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$11.352

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Kepictronics

USA . 92 parts In-Stock

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Overview

Unlock unparalleled precision and performance with the TSA1002CF from STMicroelectronics. This top-tier analog-to-digital converter is designed for applications demanding exceptional accuracy and efficiency, ensuring your projects run smoothly. With a trusted manufacturer renowned for innovation and quality, you’ll benefit from cutting-edge technology that enhances data integrity in everything from industrial automation to consumer electronics. Experience reliability, speed, and simplicity—all in a sleek, space-saving package. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy allows for a lightweight and durable package, making the device resilient to environmental factors.

Surface Mount: YES

Surface mount technology provides a compact solution, enabling high-density circuit designs and saving valuable PCB space.

Package Shape: SQUARE

The square package shape ensures ease of placement and uniformity in board layouts, enhancing assembly efficiency.

No. of Bits: 10

A 10-bit resolution allows for accurate analog-to-digital conversion suitable for various applications requiring good precision.

Maximum Linearity Error (EL): 0.0781%

Low linearity error enhances the accuracy of the ADC, providing more reliable data for critical applications.

Power Supplies (V): 2.5

The 2.5V supply voltage ensures compatibility with low-power systems, making it suitable for battery-operated devices.

No. of Terminals: 48

A higher number of terminals provides flexibility in connectivity and pin configurations for diverse applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack design with a low profile enhances space efficiency, ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

The ability to operate at high temperatures makes this product suitable for use in a variety of environments without overheating.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this ADC can function in colder conditions, expanding its application range.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and ensures reliable connections during assembly, promoting product quality.

Terminal Position: QUAD

Quad terminal position allows for optimal layout flexibility, benefiting complex circuit designs.

Maximum Seated Height: 1.6 mm

The low height specification enables the device to fit in low-profile applications where space is at a premium.

Width: 7 mm

A compact width supports high-density layouts suitable for modern electronics with limited board space.

Length: 7 mm

Similar to width, this length allows for efficient integration into small form factor designs.

Temperature Grade: COMMERCIAL

Commercial grade ensures reliability and stability for consumer electronics; ideal for general-purpose use.

Maximum Analog Input Voltage: 1.1 V

This input voltage range allows the ADC to accurately process signals from various low-voltage sources.

Sample Rate: 50 MHz

A high sample rate enables the ADC to capture rapid changes in an analog signal, making it suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high performance, allowing efficient operation in portable devices.

Terminal Form: GULL WING

The gull-wing terminal form provides excellent mechanical stability, important for reliable performance in electronic assemblies.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary conversion technique may offer unique benefits in signal processing, adding value to applications needing specific features.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage aligns with many low-power systems, promoting energy efficiency in design.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

The binary output format simplifies integration with digital processing units, widely used in computing applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a compact design without compromising on connectivity and ease of assembly.

Minimum Analog Input Voltage: 0.2 V

The ability to accept low analog input voltages expands the ADC's application possibilities in sensing and monitoring tasks.

Output Format: PARALLEL, WORD

A parallel output format can provide faster data transfer rates, beneficial for high-speed processing requirements.

Sample and Hold/Track and Hold: SAMPLE

This feature allows the ADC to accurately capture transient signals, which is crucial for precise data acquisition.

Technical Specifications

Analog-to-Digital Converters TSA1002CF attributes and parameters. Explore more Analog-to-Digital Converters devices from STMicroelectronics

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0781 %

Sample Rate:

50 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

2.5 V

Minimum Analog Input Voltage:

200 mV

Maximum Analog Input Voltage:

1.1 V

Nominal Supply Voltage:

2.5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

QFP48,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

TSA1002CF Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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