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TS555MDT

STMicroelectronics

TS555MDT by STMicroelectronics

TS555MDT by STMicroelectronics is a CMOS analog waveform generator with a max output frequency of 2 GHz and operates b/w 2-16 V. It features an operating temp range from -55 °C to 125 °C, making it ideal for military applications. Its compact SOIC-8 package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,900 parts In-Stock

1+ parts

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1,900

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Vyrian

USA . 1,470 parts In-Stock

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1,470

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Digiode

USA . 673 parts In-Stock

1+ parts

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673

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,297 parts In-Stock

1+ parts

$7.577

100+ parts

-

1k+ parts

$6.819

10k+ parts

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1,297

$7.577

-

$6.819

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MKK Technologies

India . 1,815 parts In-Stock

1+ parts

$14.248

100+ parts

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1,815

$14.248

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DigiPath Technology Company

USA . 1,815 parts In-Stock

1+ parts

$14.248

100+ parts

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10k+ parts

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1,815

$14.248

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Kepictronics

USA . 6,200 parts In-Stock

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6,200

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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6,000

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A-Z Elektronik GmbH

Germany . 5,357 parts In-Stock

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5,357

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Parana Technologies

USA . 821 parts In-Stock

1+ parts

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100+ parts

$9.060

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821

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$9.060

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Corphita

USA . 730 parts In-Stock

1+ parts

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730

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Overview

Elevate your designs with the TS555MDT from STMicroelectronics, a leader in analog waveform generation. Engineered for reliability and precision, this compact surface-mount device operates seamlessly across a wide voltage range and extreme temperatures, making it ideal for military and demanding applications. Experience enhanced performance with low power consumption and robust output capabilities, empowering your projects with the quality and innovation that only STMicroelectronics delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy body material ensures resilience and reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape optimizes space on the PCB, facilitating easy integration into designs.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3V indicates low power consumption, making it suitable for battery-operated devices.

Maximum Output Frequency: 2 GHz

With a high maximum output frequency of 2 GHz, this product is capable of generating high-speed waveforms for advanced applications.

Power Supplies (V): 2/12

Dual power supply capability (2V and 12V) provides flexibility in design and can accommodate various circuit requirements.

No. of Terminals: 8

Eight terminals allow for versatile connections and easy integration into different circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style enables efficient use of board space, making it ideal for compact applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliability in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -55 °C

Supporting a minimum operating temperature of -55 °C makes this product suitable for harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent solderability and corrosion resistance, enhancing reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in layout design, accommodating a variety of PCB configurations.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a low-profile design, suitable for space-constrained applications.

Width: 3.9 mm

A compact width of 3.9 mm makes this device ideal for integration into densely packed assemblies.

Other IC type: PULSE; RECTANGULAR

This component can generate pulse and rectangular waveforms, making it versatile for various applications.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum supply voltage of 2V allows it to function in low-voltage applications.

Length: 4.9 mm

A length of 4.9 mm supports compact designs, fitting easily into tight spaces on PCBs.

Temperature Grade: MILITARY

Military-grade specifications ensure high performance and reliability in mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, ideal for modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, enhancing product reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for more compact designs while maintaining ease of placement and soldering.

Maximum Supply Voltage (Vsup): 16 V

With a maximum supply voltage of 16V, this device can be used in a wide range of applications requiring high voltage.

Technical Specifications

Analog Waveform Generation TS555MDT attributes and parameters. Explore more Analog Waveform Generation devices from STMicroelectronics

Specs

Additional Features:

IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TS555MDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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