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SE556N

Texas Instruments

SE556N by Texas Instruments

SE556N by Texas Instruments is an Analog Waveform Generation IC with 14 terminals. It operates b/w -55°C to 125°C, suitable for military-grade applications. With power supplies of 5/15V, it utilizes bipolar technology in a rectangular plastic package for precise signal generation.

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Lifecycle Status

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8

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1k+

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Digiode

USA . 7,479 parts In-Stock

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Vyrian

USA . 6,681 parts In-Stock

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Anansix

USA . 2,703 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 400 parts In-Stock

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400

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ComSIT Distribution GmbH

Germany . 125 parts In-Stock

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PC Components Company LLC

USA . 24 parts In-Stock

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Bristol Electronics

USA . 24 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 14 parts In-Stock

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One Stop Electronics

USA . 1,695 parts In-Stock

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$0.500

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ChromeModa Solutions

Germany . 5,575 parts In-Stock

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$10.325

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$8.466

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AZTECH Wire

Italy . 708 parts In-Stock

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$11.159

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IDEA Electronic Components Group

UK . 3,578 parts In-Stock

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DigiPath Technology Company

USA . 2,911 parts In-Stock

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MKK Technologies

India . 1,004 parts In-Stock

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Corphita

USA . 7,085 parts In-Stock

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UNI Independent Distributors

Spain . 6,811 parts In-Stock

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Parana Technologies

USA . 1,971 parts In-Stock

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$16.883

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Cyclops Electronics Ltd (Excess)

UK . 405 parts In-Stock

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Perfect Parts

USA . 11 parts In-Stock

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Assy Fe

Spain . 6 parts In-Stock

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Overview

Unlock the power of precision with the SE556N from Texas Instruments, a leading name in analog waveform generation. Perfect for a wide range of applications, this versatile component offers unparalleled quality and reliability. Whether you're designing medical equipment, industrial controls, or telecommunications systems, the SE556N delivers exceptional performance and value. Trust Texas Instruments to provide cutting-edge technology that meets your needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for a variety of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into existing systems or circuits.

Power Supplies (V): 5/15

The product supports a wide range of power supplies (5V to 15V), providing flexibility in different operating conditions.

No. of Terminals: 14

With 14 terminals, the product offers multiple connection points for interfacing with other components or devices.

Package Style (Meter): IN-LINE

The in-line package style enables easy placement and soldering onto a printed circuit board or breadboard.

Maximum Operating Temperature: 125 °C

The product can operate at high temperatures up to 125°C, making it suitable for demanding environments.

Minimum Operating Temperature: -55 °C

The product can also withstand very low temperatures down to -55°C, ensuring reliability in extreme conditions.

Terminal Position: DUAL

With dual terminal positions, the product allows for flexible mounting and connection options in a circuit.

Temperature Grade: MILITARY

The military-grade temperature rating ensures ruggedness and reliability, making it suitable for harsh operating environments.

Technology: BIPOLAR

The bipolar technology used in the product allows for precise and accurate waveform generation, crucial for various applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the installation and soldering process, making it user-friendly for electronics hobbyists or professionals.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm provides a standard spacing for easy connections and compatibility with other components or breadboards.

Technical Specifications

Analog Waveform Generation SE556N attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SE556N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-010-7809, 5962010107809

NIIN

010107809

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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