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LM555H/883

Texas Instruments

LM555H/883 by Texas Instruments

LM555H/883 by Texas Instruments is a MIL-STD-883 compliant analog waveform generator with a supply voltage range of 5-15V. It operates at temperatures from -55 to 125°C and has a max output frequency of 0.051 GHz. This cylindrical package IC is ideal for military applications requiring pulse and rectangular waveforms.

Median Price

$35.450

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

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Texas Instruments

USA . 11,736 parts In-Stock

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Arrow

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Nova Conductors

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Mobius Materials

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Digiode

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Vyrian

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Bristol Electronics

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Atlantic Semiconductor

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Mil-Aero Solutions, Inc.

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First Choice Components Inc.

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Parana Technologies

USA . 407 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 1,699 parts In-Stock

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IDEA Electronic Components Group

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Continental Prestige Electronics

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Corphita

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Overview

Unlock endless possibilities with the LM555H/883 by Texas Instruments, a high-quality analog waveform generation solution that exceeds expectations. Designed for military-grade applications, this product offers reliability and precision like no other. Whether you're looking to create pulse or rectangular waveforms, this versatile device delivers exceptional results every time. Trust Texas Instruments for unmatched performance and value that will take your projects to new heights.

Feature Benefit Bullets

Package Body Material: METAL

Provides durability and protection for the components inside, making the product long-lasting and reliable.

Screening Level: MIL-STD-883

Meets strict military standards for reliability and performance, ensuring high quality.

Nominal Supply Voltage (Vsup): 5 V

Suitable for a wide range of applications and compatible with common power sources.

Maximum Output Frequency: 0.051 GHz

Capable of generating high frequency waveforms for advanced applications.

Power Supplies (V): 5/15

Versatile with support for both 5V and 15V power supplies, providing flexibility in different systems.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without any performance degradation.

Minimum Operating Temperature: -55 °C

Capable of functioning in extremely cold conditions, making it suitable for a variety of environments.

Maximum Seated Height: 4.4 mm

Compact and can fit in tight spaces, ideal for applications with limited room.

Width: 9.08 mm

Small footprint allows for easy integration into circuit boards and systems.

Other IC type: PULSE; RECTANGULAR

Supports different waveform types, expanding the range of applications it can be used for.

Minimum Supply Voltage (Vsup): 5 V

Ensures stable operation at the minimum required voltage, preventing any issues with power supply.

Length: 9.08 mm

Compact size makes it easy to incorporate into various designs and projects.

Temperature Grade: MILITARY

Built to withstand harsh conditions and rigorous use, suitable for military and defense applications.

Maximum Supply Current (Isup): 18.5 mA

Efficient power consumption for lower energy costs and reduced heat generation.

Technology: BIPOLAR

Utilizes bipolar technology for high-speed and accurate waveform generation, ensuring precise outputs.

Terminal Form: WIRE

Provides a secure and reliable connection with other components, reducing the risk of loose connections.

Terminal Pitch: 2.54 mm

Standard pitch for easy integration into existing circuit designs and breadboard setups.

Maximum Supply Voltage (Vsup): 15 V

Supports higher voltage inputs for applications that require more power, offering versatility in usage scenarios.

Technical Specifications

Analog Waveform Generation LM555H/883 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

O-MBCY-W8

Length:

9.08 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

.051 GHz

Package Body Material:

METAL

Package Code:

Package Equivalence Code:

CAN8,.2

Package Shape:

Package Style (Meter):

CYLINDRICAL

Power Supplies (V):

5/15

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

4.4 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Current (Isup):

18.5 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

WIRE

Terminal Pitch:

2.54 mm

Terminal Position:

BOTTOM

Width (mm):

9.08 mm

Trade Compliance

LM555H/883 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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