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TS507ID

STMicroelectronics

TS507ID by STMicroelectronics

TS507ID by STMicroelectronics is a low-offset operational amplifier ideal for automotive applications. It features a max input offset voltage of 750 µV, a common mode reject ratio of 115 dB, and operates within -40 °C to 125 °C. This compact SMD device ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,666 parts In-Stock

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7,666

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Anansix

USA . 2,163 parts In-Stock

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2,163

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Digiode

USA . 1,506 parts In-Stock

1+ parts

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1,506

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Martec Srl

Italy . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 247 parts In-Stock

1+ parts

$4.567

100+ parts

-

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247

$4.567

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IDEA Electronic Components Group

UK . 1,868 parts In-Stock

1+ parts

$5.937

100+ parts

-

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$5.343

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1,868

$5.937

-

$5.343

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Semicontronic

India . 1,165 parts In-Stock

1+ parts

$6.410

100+ parts

$6.250

1k+ parts

$6.218

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-

1,165

$6.410

$6.250

$6.218

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AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$8.610

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874

$8.610

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MKK Technologies

India . 1,897 parts In-Stock

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$11.164

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1,897

$11.164

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DigiPath Technology Company

USA . 1,897 parts In-Stock

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$11.164

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1,897

$11.164

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Component Stockers USA

USA . 640 parts In-Stock

1+ parts

$99.990

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640

$99.990

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Corphita

USA . 2,355 parts In-Stock

1+ parts

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2,355

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Vigor

Singapore . 1,693 parts In-Stock

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1,693

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Parana Technologies

USA . 156 parts In-Stock

1+ parts

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$7.098

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156

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$7.098

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Overview

Unlock exceptional precision and reliability with the TS507ID Operational Amplifier from STMicroelectronics—a leader in semiconductor innovation. Designed for a wide range of applications, including automotive systems and industrial controls, this compact yet powerful op-amp boasts impressive low-offset voltage and minimal bias current. Elevate your designs with a product that combines superior performance, robustness, and the trusted quality of STMicroelectronics, ensuring you stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in a variety of environments, making it a robust choice for automotive applications.

Maximum Input Offset Voltage: 750 uV

A low maximum input offset voltage enhances accuracy and precision, ideal for sensitive signal processing.

Maximum Average Bias Current (IIB): 0.11 uA

Minimized bias current reduces errors in high-impedance applications, ensuring better performance in precision circuits.

Surface Mount: YES

Surface mount configuration allows for efficient space usage and integration into compact designs, facilitating modern PCB layouts.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on circuit boards, making it suitable for high-density applications.

Nominal Common Mode Reject Ratio: 115 dB

A high common mode rejection ratio ensures effective noise rejection, which is essential for maintaining signal integrity in complex environments.

Nominal Supply Voltage / Vsup: 5 V

Nominal supply voltage of 5V provides compatibility with standard logic levels, making it suitable for various applications.

Power Supplies (V): 3/5

The flexibility in supply voltage ranges allows for versatility in different designs and applications, accommodating various operational requirements.

No. of Terminals: 8

The 8 terminal configuration allows for a variety of connections and functions, providing design flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, facilitating compact and efficient design.

Maximum Supply Voltage Limit: 6 V

This moderate voltage limit allows for operation in a variety of standard circuits without risking damage.

Maximum Operating Temperature: 125 °C

High maximum operating temperature rating ensures reliable performance in demanding automotive environments.

Maximum Bias Current (IIB) @ 25C: 0.145 uA

The low bias current at 25 °C further enhances the performance in precision applications where input currents must be minimized.

Frequency Compensation: YES

Built-in frequency compensation simplifies design by stabilizing the amplifier without requiring external components.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures functionality in extreme conditions, making it suitable for automotive use.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish improves solderability and ensures reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in PCB layout designs, allowing for more straightforward integration.

Low-Offset: YES

Low-offset features make this op-amp an excellent choice for high-precision applications requiring minimal drift.

Maximum Seated Height: 1.75 mm

The low seated height facilitates effective stacking and reduces the overall height of compact assemblies.

Width: 3.9 mm

A narrow width allows for efficient layout in tight spaces on circuit boards.

Maximum Time At Peak Reflow Temperature: 40 s

This specification ensures resilience during the soldering process, protecting the integrity of the components.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature means it can withstand modern soldering processes without damage.

Length: 4.9 mm

Compact length makes it suitable for miniaturized circuits, enhancing design flexibility.

Temperature Grade: AUTOMOTIVE

Automotive temperature grading signifies reliability and robustness for use in vehicles, ensuring compliance with stringent automotive standards.

Maximum Negative Supply Voltage Limit: 0 V

A zero negative supply voltage limit simplifies design considerations, making it easier to integrate into single-supply applications.

Nominal Unity Gain Bandwidth: 1900 kHz

High unity gain bandwidth indicates suitability for high-speed applications, allowing for rapid signal processing.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical stability, reducing the risk of damage.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it provides versatility for a wide range of applications from signal conditioning to filtering.

Maximum Supply Current: 1.25 mA

Low supply current ensures energy efficiency, which is important for battery-operated and low-power applications.

Nominal Negative Supply Voltage (Vsup): 0 V

The nominal negative supply voltage of 0 V allows for easy integration into single-ended circuits.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is preferred for many applications due to its stability and performance in various conditions.

Packing Method: TUBE

Packaging in tubes helps protect the components during shipping and storage, ensuring they arrive undamaged.

Nominal Slow Rate: 0.6 V/us

A nominal slew rate allows for sufficient signal handling, making it suitable for a variety of audio and sensor applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates compatibility with a wide range of PCB layouts and components.

Technical Specifications

Operational Amplifiers (Op Amps) TS507ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.9 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

115 dB

Input Offset Voltage Limit:

750 uV

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

110 nA

Maximum Bias Current (IIB) @25 °C:

145 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

1.25 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS507ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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