Loading...

TS507IYDT

STMicroelectronics

TS507IYDT by STMicroelectronics

TS507IYDT by STMicroelectronics is a low-offset operational amplifier ideal for automotive applications. It features a max input offset voltage of 750 µV, a common mode reject ratio of 115 dB, and operates within -40 °C to 125°C. This compact SMD design ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,946

-

-

-

-

Vyrian

USA . 3,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,355

-

-

-

-

Anansix

USA . 757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

757

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,591 parts In-Stock

1+ parts

$4.279

100+ parts

-

1k+ parts

$3.851

10k+ parts

-

1,591

$4.279

-

$3.851

-

MKK Technologies

India . 2,250 parts In-Stock

1+ parts

$8.046

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

$8.046

-

-

-

DigiPath Technology Company

USA . 2,250 parts In-Stock

1+ parts

$8.046

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

$8.046

-

-

-

Corphita

USA . 2,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,496

-

-

-

-

Parana Technologies

USA . 125 parts In-Stock

1+ parts

-

100+ parts

$5.116

1k+ parts

-

10k+ parts

-

125

-

$5.116

-

-

Overview

Experience unmatched precision with the TS507IYDT operational amplifier from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for automotive and industrial applications, this low-offset op-amp ensures reliability and performance under extreme conditions. Its compact size and surface mount capability streamline your designs, while exceptional common-mode rejection enhances signal integrity. Choose STMicroelectronics for quality you can trust, transforming your projects into cutting-edge successes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 750 uV

A low input offset voltage contributes to improved precision and accuracy in signal processing, essential for high-stakes applications.

Maximum Average Bias Current (IIB): 0.11 uA

Very low bias current minimizes error in precision applications and makes the op amp suitable for low power designs.

Surface Mount: YES

Surface mount capability allows for easy integration into modern circuit designs, saving space and enhancing performance.

Package Shape: RECTANGULAR

The rectangular shape is optimal for PCB layout and integration, allowing for efficient space utilization.

Nominal Common Mode Reject Ratio: 115 dB

A high common mode reject ratio (CMRR) minimizes interference from noise and ensures high integrity of the signal.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5V is standard for many applications, providing compatibility with various devices and circuits.

Power Supplies (V): 3/5

Flexible power supply options (3V or 5V) enhance versatility, allowing the op amp to function in different systems.

No. of Terminals: 8

Having 8 terminals allows for various configurations and functionalities, catering to different circuit requirements.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes board space and supports high-density circuit designs.

Maximum Supply Voltage Limit: 6 V

A maximum supply voltage limit of 6V ensures safe operation in a broad range of applications without risk of damage.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit, this op amp is suitable for harsh environments, such as automotive applications.

Frequency Compensation: YES

Frequency compensation ensures stability in a variety of applications, enhancing performance and preventing oscillation issues.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this Op Amp ideal for extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Ni/Pd/Au provides excellent conductivity and corrosion resistance, extending the component's lifespan.

Terminal Position: DUAL

Dual terminal positions enhance flexibility in design, allowing for better integration into various PCB layouts.

Low-Offset: YES

Low-offset characteristics improve performance in precision applications, making this Op Amp suitable for sensitive measurements.

Maximum Seated Height: 1.75 mm

A compact seated height allows for effective space-saving in crowded circuit boards.

Width: 3.9 mm

A narrow width enhances its suitability for applications where space is a premium.

Maximum Time At Peak Reflow Temperature: 40 s

This specification ensures compatibility with standard PCB assembly processes, allowing for efficient manufacturing.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature indicates robustness during soldering processes, ensuring reliable assembly.

Length: 4.9 mm

A compact length contributes to overall size efficiency without compromising performance.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this Op Amp can withstand the rigors of vehicle environments, ensuring reliability.

Maximum Negative Supply Voltage Limit: 0 V

This characteristic allows for clean signal integrity by preventing negative voltages, essential in many low-level signal applications.

Nominal Negative Supply Voltage (Vsup): 0 V

With a nominal negative supply voltage of 0V, this Op Amp can operate efficiently in single-supply configurations.

Nominal Unity Gain Bandwidth: 1900 kHz

A high unity gain bandwidth allows for fast signal processing and is suitable for applications requiring high frequency performance.

Maximum Supply Current: 1.25 mA

Low supply current contributes to energy efficiency, making this Op Amp suitable for battery-powered applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides excellent linearity and wide bandwidth suitable for various signal conditioning tasks.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated assembly, enhancing production efficiency.

Nominal Slow Rate: 0.6 V/us

This slow rate specification indicates stability in response time, crucial for precision in time-sensitive applications.

Terminal Pitch: 1.27 mm

A standardized terminal pitch allows easy integration into diverse PCB layouts and ensures compatibility with existing board designs.

Technical Specifications

Operational Amplifiers (Op Amps) TS507IYDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.9 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

115 dB

Input Offset Voltage Limit:

750 uV

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

110 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

1.25 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS507IYDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11